Product Code: ICAL05_P513

Laser Processing of Solder Prevention Coating
Authors:
Antti Salminen, Lappeenranta University of Technology; Lappeenranta Finland
Tony Vesterinen, Lappeenranta University of Technology; Lappeenranta Finland
Presented at ICALEO 2005

The last work phase of PCB manufacture prior installation of components is to remove the solder prevention paint and to reveal the positions in which the components will be connected. Traditionally this is carried out with etching, which is a chemical process. This work concentrates on removal of this coating with laser processing. Different lasers were tested in this task and laser showed to be accurate, flexible and fast tool for doing this work. Nd:YAG laser showed better accuracy reaching 29?m accuracy whereas CO2 laser was better in respect of processing speed. The accuracy of CO2 laser was of lower level. The beam quality plays an important role in the processing showing in case of Nd:YAG welding much higher quality in accuracy vice but also when the shape of the processed edge was taken into account. The data transformation from CAD-files to processing program can be carried out fast with all of the lasers providing the user a high flexibility. Use of laser to this new application is a promising application especially in cases where high flexibility gives extra advantages.