Product Code: ICAL09_M206

Material Removal Rates in Ultra-high-speed Micro Machining using a Picosecond Laser
Authors:
Tero Kumpulainen, Tampere University of Technology; Tampere Finland
Ilpo Karjalainen, Tampere University of Technology; Tampere Finland
Reijo Tuokko, Tampere University of Technology; Tampere Finland
Presented at ICALEO 2009

Ultrashort pulse lasers combined with megahertz level repetition rates allow use of higher production speeds without that sequent pulses do not overlap. The experiments were conducted on stainless steel and brass samples with several different velocities up to about 30 m/s with 1 and 2 MHz repetition rates. The material removal rates were analyzed from the laser machined grooves. Higher machining speeds are used to enable higher production speeds and lowering pulse overlap. With high pulse overlap, part of the beam power is reflected and absorbed into vaporing metal ablated by the previous pulse. Additionally heat conducted to the material decreases due shorter interaction to the material, if higher processing speeds can be used. Samples were attached to a high-speed rotating spindle, which can be rotated up to 80000 rpm with a small load. Grooves were analyzed with a profilometer and an optical microscope, and material removal rates in the grooves were calculated. In addition, lasers material removal rate per pulse energy was observed.