Product Code: ICA13_406

Simulation of Process Dynamics in Laser Beam Brazing
Authors:
Michael Dobler, Institute of Photonic Technologies and Erlangen Graduate School in Advanced Optical Technologies (Saot), University of Erlangen-Nuremberg; Erlangen Germany
Karl-Heinz Leitz, Institute of Photonic Technologies and Erlangen Graduate School in Advanced Optical Technologies (Saot), University of Erlangen-Nuremberg; Erlangen Germany
Andreas Otto, Institute for Production Engineering and Laser Technology, Vienna University of Technology; Vienna Austria
Michael Schmidt, Institute of Photonic Technologies and Erlangen Graduate School in Advanced Optical Technologies (Saot), University of Erlangen-Nuremberg; Erlangen
Presented at ICALEO 2013

In order to gain a deeper understanding of the laser beam brazing process, a transient three-dimensional simulation model of laser beam brazing was developed. In the multi-physical model, beam-matter interaction, heat transfer as well as melting and resolidification of base and filler material are implemented. Furthermore, the flow dynamics in the melt and the surrounding medium is calculated. By using an appropriate wetting model, the wetting of the base material by the filler material can be simulated. Additionally, for a realistic modeling of the brazing process movement of the filler wire is also included in the model.
To verify the model metallographic analysis and high-speed camera based process observations are compared to the simulation results. The agreement of experiments and simulations confirms the capabilities of the multi-physical approach. Based on the simulation model, wetting behavior as well as melt dynamics of the brazing solder is analyzed. Moreover, simulations were performed that show the effect of different laser powers on melt temperature and melt dynamics. The results demonstrate that detailed simulations of the laser brazing process can not only provide insight into the process dynamics but are also a versatile tool for process optimization and process planning.