ICALEO 2009 Paper #M307 (Rapid Prototyping of Microchannels into Silicon with a Femtosecond Fiber Laser)

Rapid Prototyping of Microchannels into Silicon with a Femtosecond Fiber Laser
Authors:
Dong Hyuck Kam, CLAIM, The University of Michigan; Ann Arbor MI USA
Jyoti Mazumder, Clpam, the University of Michigan; Ann Arbor MI USA
Presented at ICALEO 2009

We report on rapid prototyping of microchannels into silicon wafer with a femtosecond pulsed laser. The microchannel is a basic component composing microfludic structures for biomedical applications. In development of such micro-fluidic structures, the mask-less laser direct writing will reduce time and cost as a tool for rapid prototyping compared with the conventional photolithography based technique. While fs ablation ends to be more ...

ICALEO 2009 Paper #M305 (Analytical Model for CW-Laser Cleaving of Semiconductors)

Analytical Model for CW-Laser Cleaving of Semiconductors
Authors:
Viktor Schütz, Laser Zentrum Hannover e.V.; Hannover Germany
Oliver Haupt, Laser Zentrum Hannover e.V.; Hannover Germany
Rainer Kling, Laser Zentrum Hannover e.V.; Hannover Germany
Presented at ICALEO 2009

The cw-laser cleaving process strongly depends on the temperature rise in the semiconductor and therefore from the active and passive process parameters. In the past, various methods have been developed to evaluate the process parameters in cw-laser processing of materials. The finite element method is a powerful tool for simulating heat conduction for all kinds of geometries, however, it turns out to...

ICALEO 2009 Paper #M304 (Debris-free Low-stress Laser Dicing for Multi-layered MEMS Wafer)

Debris-free Low-stress Laser Dicing for Multi-layered MEMS Wafer
Authors:
Masayuki Fujita, Institute for Laser Technology; Osaka Japan
Yusaku Izawa, Institute of Laser Engineering, Osaka University; Suita Japan
Yosuke Tsurumi, Institute of Laser Engineering, Osaka University; Suita Japan
Shuji Tanaka, Tohoku University; Sendai Japan
Hideyuki Fukushi, Tohoku University; Sendai Japan
Keiichi Sueda, Institute of Laser Engineering, Osaka University; Suita Japan
Yoshiki Nakata, Institute of Laser Engineering, Osaka University; Suita Japan
Noriaki Miyanaga, Institute of Laser Engineering, Osaka University; Suita Japan
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ICALEO 2009 Paper #M303 (Spatial Micro-Processing of Mono-Crystallin Silicon with Hybrid Chemical-Laser Etching Method in KOH with the Use of Fiber Laser)

Spatial Micro-Processing of Mono-Crystallin Silicon with Hybrid Chemical–Laser Etching Method in KOH with the Use of Fiber Laser
Authors:
Adam Rosowski, Technical University of Lodz; Lodz Poland
Heidi Piili, Lappeenranta University of Technology; Lappeenranta Finland
Ryszard Pawlak, Technical University of Lodz; Lodz Poland
Veli Kujanpaa, Lappeenranta University of Technology and VTT; Lappeenranta Finland
Antti Salminen, Lappeenranta University of Technology; Lappeenranta Finland
Presented at ICALEO 2009

This study presents a hybrid technology of chemical and laser spatial processing (HCL) for spatial micro-processing of monocrystalline sili...

ICALEO 2009 Paper #M302 (Micro Structuring of Sapphire and Fused Silica by High Speed and High Precision In-volume Selective Laser Etching)

Micro Structuring of Sapphire and Fused Silica by High Speed and High Precision In-volume Selective Laser Etching
Authors:
Martin Hermans, Lehrstuhl Fuer Lasertechnik Rwth Aachen University; Aachen Germany
Jens Gottmann, Lehrstuhl Fuer Lasertechnik Rwth Aachen University; Aachen Germany
Maren Hoerstmann-Jungemann, Lehrstuhl Fuer Lasertechnik Rwth Aachen University; Aachen Germany
Philipp Kramer, Lehrstuhl fur Lasertechnik, RWTH Aachen University; Aachen Germany
Presented at ICALEO 2009

Micro structuring of sapphire and fused silica is an important market e.g. the production of microfluidic devices and sensors that combine optical and microfluidic functions...

ICALEO 2009 Paper #M301 (Laser Internal Modification plus Wet Etching for Micro-structuring Crystalline and Glassy Materials (Invited Presentation, 40 minutes))

Laser Internal Modification plus Wet Etching for Micro-structuring Crystalline and Glassy Materials (Invited Presentation, 40 minutes)
Authors:
Shigeki Matsuo, The University of Tokushima; Tokushima Japan
Presented at ICALEO 2009

Thanks to the recent progress in femtosecond (fs) laser technology, now fs laser is regarded as a powerful tool for micro/nano processing of materials. We apply fs lasers to three-dimensional (3D) removal processing inside transparent solid. The procedure of this processing consists of two steps. The first step is irradiation of focused fs pulses, which results in a modification of host material in the vicinity of the focus. By moving the sample, modified spots are...

ICALEO 2009 Paper #M209 (MOPA Pulsed Fiber Laser with Controlled Peak Power and Pulse Energy for Micromachining of Hard Materials)

MOPA Pulsed Fiber Laser with Controlled Peak Power and Pulse Energy for Micromachining of Hard Materials
Authors:
Sami Hendow, Multiwave Photonics; - USA
João Sousa, Multiwave Photonics; Maia Portugal
Paulo Guerreiro, Multiwave Photonics; Maia Portugal
Niels Schilling, Fraunhofer Institute IWS Dresden; Dresden Germany
Jan Rabe, Fraunhofer Institute IWS Dresden; Dresden Germany
Presented at ICALEO 2009

Control of pulse parameters, such as pulse energy, peak power and pulse length, is important for optimizing the lasers parameter, as well as identifying the processing window of many hard materials. Examples of such materials are thin film c...

ICALEO 2009 Paper #M208 (High Quality Machining of Non-Metals with a Picosecond Laser)

High Quality Machining of Non-Metals with a Picosecond Laser
Authors:
B.R. Campbell, Penn State Electro-Optics Center; Freeport PA USA
J. A. Moore, Penn State Electro-Optics Center; Freeport PA USA
T. M. Lehecka, Penn State Electro-Optics Center; Freeport PA USA
J. G. Thomas, Penn State Electro-Optics Center; Freeport PA USA
V. V. Semak, Penn State Electro-Optics Center; Freeport PA USA
Presented at ICALEO 2009

Using a commercial picosecond laser system, experiments were performed to cleanly machine non-metals and measure material removal rates. The laser was operated at 532 and 355 nm using a unique pulse format and a galvo scanner to transl...

ICALEO 2009 Paper #M206 (Material Removal Rates in Ultra-high-speed Micro Machining using a Picosecond Laser)

Material Removal Rates in Ultra-high-speed Micro Machining using a Picosecond Laser
Authors:
Tero Kumpulainen, Tampere University of Technology; Tampere Finland
Ilpo Karjalainen, Tampere University of Technology; Tampere Finland
Reijo Tuokko, Tampere University of Technology; Tampere Finland
Presented at ICALEO 2009

Ultrashort pulse lasers combined with megahertz level repetition rates allow use of higher production speeds without that sequent pulses do not overlap. The experiments were conducted on stainless steel and brass samples with several different velocities up to about 30 m/s with 1 and 2 MHz repetition rates. The material removal rates were analyzed from the ...

ICALEO 2009 Paper #M205 (Femtosecond Laser Pulse Ablation of Polyurea Areogel)

Femtosecond Laser Pulse Ablation of Polyurea Areogel
Authors:
Qiumei Bian, ; Manhattan KS USA
Shouyuan Chen, Kansas State University; Manhattan KS USA
Zenghu Chang, Kansas State University; Manhattan KS USA
Shuting Lei, Kansas State University; Manhattan KS USA
Presented at ICALEO 2009

Femtosecond laser pulses with pulse trains of different repetition rates are employed in micromachining of a polyurea aerogel material. By varying the pulse number in a pulse train and the repetition rate of the pulse train, we investigate their effects on the ablation surface morphology of the polyurea aerogels. The heat accumulating in the polymer material can be prevented...