ICALEO 2010 Paper #M503 (Microlens Arrays Fabricated on Polycarbonate Sheets Via Pulsed Laser Maskless Interference Patterning)
Microlens Arrays Fabricated on Polycarbonate Sheets Via Pulsed Laser Maskless Interference Patterning
Authors:
Rui Guo, Woodruff School of Mechanical Engineering, Georgia Institute of Technology; Atlanta GA USA
Dajun Yuan, Woodruff School of Mechanical Engineering, Georgia Institute of Technology; Atlanta GA USA
Suman Das, Woodruff School of Mechanical Engineering, Georgia Institute of Technology; Atlanta GA USA
Presented at ICALEO 2010
: A method is developed to fabricate large areas of microlens arrays on flexible substrates of polycarbonate film via maskless laser interference patterning. Nanosecond pulsed Nd:YAG laser with 266nm wavelength is used to generate two-...$28.00
ICALEO 2010 Paper #M502 (Laser Fabrication of Nanobump Arrays on Si Substrate Via Optical Near-Field Enhancement)
Laser Fabrication of Nanobump Arrays on Si Substrate Via Optical Near-Field Enhancement
Authors:
X.C. Wang, Singapore Institute of Manufacturing Technology (SIMTech); Singapore Singapore
Hongyu Zheng, Singapore Institute of Manufacturing Technology; Singapore Singapore
C. W. Tan, Singapore Institute of Manufacturing Technology (SIMTech); Singapore Singapore
F. Wang, Nanyang Technological University; Singapore Singapore
H. Y. Yu, Nanyang Technological University; Singapore Singapore
K. L. Pey, Nanyang Technological University; Singapore Singapore
Presented at ICALEO 2010
Fabrication technologies on the submicrometer and even nanome...$28.00
ICALEO 2010 Paper #M501 (Permanent Marking on Stainless Steels for Corrosion Resistance Through Control of Oxide Growth)
Permanent Marking on Stainless Steels for Corrosion Resistance Through Control of Oxide Growth
Authors:
Hongqiang Chen, Miyachi Unitek Corporation; Monrovia USA
Geoff Shannon, Miyachi Unitek Corporation; Monrovia CA USA
Mark Brodsky, Spi Lasers, SPI Lasers LLC; Santa Clara USA
Presented at ICALEO 2010
A requirement exists to permanently mark medical instruments and implants. These materials are selected for the specific applications by mechanical properties and resistance to corrosion and aggressive cleaning methods. The major challenge presented for laser marking is to create a visible mark without compromising the corrosion resistance of the material. This require...$28.00
ICALEO 2010 Paper #M409 (Laser Splicing Technology for Thermoplastic Film Material)
Laser Splicing Technology for Thermoplastic Film Material
Authors:
Naoyuki Matsuo, Nitto Denko Corporation; Kameyama, Mie Japan
Mayu Shimoda, Nitto Denko Corporation; Kameyama, Mie Japan
Ryuta Kibe, Nitto Denko Corporation; Kameyama, Mie Japan
Atsushi Hino, Nitto Denko Corporation; Kameyama, Mie Japan
Peter Abels, Fraunhofer Institute for Laser Technology; Aachen Germany
Andreas Roesner, Fraunhofer Institute for Laser Technology; Aachen Germany
Alexander Olowinsky, Fraunhofer Institute for Laser Technology; Aachen Germany
Presented at ICALEO 2010
Recently, near-infrared lasers show remarkable progress in terms of outp...$28.00
ICALEO 2010 Paper #M408 (Low Temperature Wafer-Level Packaging of MEMS using Selective Laser Bonding)
Low Temperature Wafer-Level Packaging of MEMS using Selective Laser Bonding
Authors:
Norbert Lorenz, Heriot-Watt University, Applied Optics and Photonics Group School of Engineering and Physical Sciences; Edinburgh Great Britain
Martin Smith, Heriot-Watt University, Applied Optics and Photonics Group School of Engineering and Physical Sciences; Edinburgh Great Britain
Duncan Hand, Heriot-Watt University, Applied Optics and Photonics Group School of Engineering and Physical Sciences; Edinburgh Great Britain
Presented at ICALEO 2010
In recent years there has been significant interest in the development of new types of Micro-Electro-Mechanical-Systems (MEMS) and related m...$28.00
ICALEO 2010 Paper #M406 (Direct Joining of FPC and Metal Electrode by Pulsed Nd:YAG Laser)
Direct Joining of FPC and Metal Electrode by Pulsed Nd:YAG Laser
Authors:
Mohd Idris Shah Ismail, Okayama University; Okayama Japan
Yasuhiro Okamoto, Okayama University; Okayama Japan
Yoshiyuki Uno, Okayama University; Okayama Japan
Presented at ICALEO 2010
Laser micro-welding is widely used for the manufacturing process in the electrical and the electronics industries, where the demands for the miniaturization, the high strength and temperature resistance are constantly increasing. Recently, a flexible printed circuit (FPC) is expected as a connection technology between electrical conductors according to the improvement of reliability and controllability with diversif...$28.00
ICALEO 2010 Paper #M405 (Laser Welding of a Microscale-VLE Measurement Device and Its Practical Application)
Laser Welding of a Microscale-VLE Measurement Device and Its Practical Application
Authors:
Marika HirvimäKi, Lappeenranta University of Technology, Laser Processing Technology Research Group, Faculty of Technology; Lappeenranta Finland
Heidi Piili, Lappeenranta University of Technology, Laser Processing Technology Research Group, Faculty of Technology; Lappeenranta Finland
Arttu Jussila, LUT Laser/Lappeenranta UnivLappeenranta University of Technology, Laser Processing Technology Research Group, Faculty of Technology; Lappeenranta Finland
Tuomas Purtonen, Lappeenranta University of Technology, Laser Processing Technology Research Group, Faculty of Technology; Lappeenranta...$28.00
ICALEO 2010 Paper #M404 (Thermokinetic Processes in Laser Welding of Current Leads)
Thermokinetic Processes in Laser Welding of Current Leads
Authors:
Ryszard Pawlak, Technical University of Lodz, Division of Material Science & Elektrotechnology; Lodz Poland
Mariusz Tomczyk, Technical University of Lodz, Division of Material Science & Elektrotechnology; Lodz Poland
Maria Walczak, Technical University of Lodz, Division of Material Science & Elektrotechnology; Lodz Poland
Adam Rosowski, Technical University of Lodz; Lodz Poland
Presented at ICALEO 2010
The aim of this study was to investigate the usefulness of the laser welding technology for the realization of wire connections: semiconductor structure- outer leading out in power devices. L...$28.00
ICALEO 2010 Paper #M403 (Laser Beam Welding of Electrical Interconnections for Lithium-Ion Batteries)
Laser Beam Welding of Electrical Interconnections for Lithium-Ion Batteries
Authors:
Jens Gedicke, Fraunhofer Institute for Lasertechnology; Aachen Germany
Benjamin Mehlmann, Fraunhofer Institute for Laser Technology; Aachen Germany
Alexander Olowinsky, Fraunhofer Institute for Lasertechnology; Aachen Germany
Arnold Gillner, Fraunhofer Institute for Laser Technology; Aachen Germany
Presented at ICALEO 2010
Lithium-ion batteries are growing in popularity for automotive applications due to their high energy density. The cells used in such batteries are often so called pouch bag cells which are equipped with two contact tabs made of copper and aluminum for an...$28.00
ICALEO 2010 Paper #M402 (Enhancing Process Stability in Infrared Laser Micro Welding of Copper using Frequency Converted Short Prepulses)
Enhancing Process Stability in Infrared Laser Micro Welding of Copper using Frequency Converted Short Prepulses
Authors:
Anas Moalem, Laser Zentrum Hannover e.V.; Hannover Germany
Philipp von Witzendorff, Laser Zentrum Hannover e.V.; Hannover Germany
Maik Frede, neoLASE GmbH; Hannover Germany
Rainer Kling, Laser Zentrum Hannover e.V.; Hannover Germany
Presented at ICALEO 2010
We present an approach in which the advantages of two laser concepts are combined in a cost effective joint process: While IR spot welding laser sources are available with high mean powers (up to 500W), 532nm radiation provides a more reliable, yet limited heat source for copper proce...$28.00
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