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  • ICALEO 2008 Paper #M1101 (A Detailed Study of the Mechanism of Rapid Laser Patterning of Indium Tin Oxide Thin Films)

    A Detailed Study of the Mechanism of Rapid Laser Patterning of Indium Tin Oxide Thin Films
    Authors:
    Paul M. Harrison, Powerlase Ltd; Crawley Great Britain
    Nick Hay, Powerlase Ltd; Crawley Great Britain
    Duncan Hand, Heriot-Watt University; Edinburgh Great Britain
    Jozef Wendland, Heriot Watt University; Edinburgh Great Britain
    Presented at ICALEO 2008

    The process of rapid laser patterning (RLP) of ITO thin films on glass has been adopted into mass production by the flat panel displays industry. This process involves high speed selective removal of thin films for the manufacture of transparent electrode structures and uses high average power, high peak pow...

    $28.00

  • ICALEO 2008 Paper #M108 (Utilization of 515 nm Pulsed Fiber Laser for Low Temperature Nanoparticle Sintering)

    Utilization of 515 nm Pulsed Fiber Laser for Low Temperature Nanoparticle Sintering
    Authors:
    Jussi Pekkanen, Tampere University of Technology - Department of Electronics; Tampere Finland
    Tero Kumpulainen, Tampere University of Technology - Department of Production Engineering; Tampere Finland
    Presented at ICALEO 2008

    Printed electronics is a promising new technology to produce low-cost electronics. Electronic devices can be printed using nano-scale metal particle inks, which can revolutionize the electronics industry in a near future. Due to a small particle size metallic nanoparticles can be sintered to homogeneous electrically conductive traces at rather feasible temperatures e.g...

    $28.00

  • ICALEO 2008 Paper #M107 (Measurement of Plasma and Shock-Wave Dynamics and Properties Inside Holes during Laser Drilling of Metals)

    Measurement of Plasma and Shock-Wave Dynamics and Properties Inside Holes during Laser Drilling of Metals
    Authors:
    Ingomar Kelbassa, Lehrstuhl Fuer Lasertechnik, Rwth Aachen University; Aachen Germany
    Kurt Walther, Lehrstuhl F Lasertechnik, Rwth Aachen; Aachen Germany
    Martin Hermans, Lehrstuhl Fuer Lasertechnik, Rwth Aachen University; Aachen Germany
    Michel Kaminsky, Lehrstuhl Fuer Lasertechnik, Rwth Aachen University; Aachen Germany
    Mihael Brajdic, Lehrstuhl Fuer Lasertechnik, Rwth Aachen University; Aachen Germany
    Presented at ICALEO 2008

    Laser material processing is influenced by plasma formation and dynamics such as plasma shielding or ...

    $28.00

  • ICALEO 2008 Paper #M106 (Spatter Reduction During Titanium Microdrilling Using Pulsed Fiber Laser)

    Spatter Reduction During Titanium Microdrilling Using Pulsed Fiber Laser
    Authors:
    Barbara Previtali, Politecnico Di Milano; Milano Italy
    Carlo Alberto Biffi, Politecnico Di Milano; Milan Italy
    Presented at ICALEO 2008

    The request of small features obtained by means of laser technology has been growing in several fields, such as micromechanical, microelectronic and biomedical ones. Commercially pure (c.p.) titanium and its alloys are very interesting materials in biomedical and aerospace applications, such as prostheses and engine turbine blades. However the high tendency of c.p. titanium to produce spatter and remelted material can be an impediment to the diffusion of laser machini...

    $28.00

  • ICALEO 2008 Paper #M105 (Uv Laser Micromachining for the Electronics Industry (Invited Presentation - 40 Minutes))

    Uv Laser Micromachining for the Electronics Industry (Invited Presentation - 40 Minutes)
    Authors:
    Jae-Hoon Lee, Korea Industry of Machinery & Materials; South Korea
    Hyonkee Sohn, Korea Institute of Machinery & Materials; Daejeon South Korea
    Dong-Sig Shin, Korea Institute of Machinery & Materials; Daejeon South Korea
    Ji-Whan Noh, Korea Institute of Machinery & Materials; Daejeon South Korea
    Nam-Sung Kim, Eo Technics; Anyang South Korea
    Gi-Jung Nam, Jettech; Incheon-Si South Korea
    Presented at ICALEO 2008

    Ultraviolet laser micromachining has increasingly been applied to the electronics industry where precision machining of high-d...

    $28.00

  • ICALEO 2008 Paper #M104 (Glass Drilling with Near Infrared Laser Radiation)

    Glass Drilling with Near Infrared Laser Radiation
    Authors:
    F. Ziems, Laser Zentrum Hannover E.V.; Hannover Germany
    L. Richter, Laser Zentrum Hannover E.V.; Hannover Germany
    R. Kling, Laser Zentrum Hannover E.V.; Hannover Germany
    A. Ostendorf, Laser Zentrum Hannover E.V.; Hannover Germany
    Presented at ICALEO 2008

    Today glass parts are used in many fields of application, e.g. architecture, automotive and technical glasses or electronics. This generates the need for bores with different diameters in various glass types and thicknesses. The conventional macroscopic process is mechanical, utilizes diamond tools, requires at least one tool for each diameter and ...

    $28.00

  • ICALEO 2008 Paper #M102 (Debris-free Laser Dicing for Multi-layered Mems)

    Debris-free Laser Dicing for Multi-layered Mems
    Authors:
    Masayuki Fujita, Institute for Laser Technology; Suita Japan
    Yusaku Izawa, Institute of Laser Engineering, Osaka University; Suita Japan
    Yosuke Tsurumi, Institute of Laser Engineering, Osaka University; Suita Japan
    Shuji Tanaka, Department of Nano-Mechanics, Tohoku University; Sendai Japan
    Hideyuki Fukushi, Department of Nano-Mechanics, Tohoku University; Sendai Japan
    Keiichi Sueda, Institute of Laser Engineering, Osaka University; Suita Japan
    Yoshiki Nakata, Institute of Laser Engineering, Osaka University; Suita Japan
    Noriaki Miyanaga, Institute of Laser Engineerin...

    $28.00

  • ICALEO 2008 Paper #M101 (Dicing of Hb-Led Devices Embedded in Copper Substrates)

    Dicing of Hb-Led Devices Embedded in Copper Substrates
    Authors:
    Marie Di Marco, Synova Sa; Ecublens Switzerland
    Alexandre Pauchard, Synova Sa; Ecublens Switzerland
    Akos Spiegel, Synova Sa; Ecublens Switzerland
    Bernold Richerzhagen, Synova Sa; Ecublens Switzerland
    Notker U. Kling, Synova Usa; Fremont USA
    Presented at ICALEO 2008

    High-brightness light emitting diodes are often embedded into a heat sink layer, providing an efficient and inexpensive method of expending the surface area necessary to dissipate heat generated during operation. Copper, copper tungsten and Molybdenum layers offer high-performance thermal management due to high thermal ...

    $28.00

  • ICALEO 2008 Paper #908 (Laser Alloyed Al-Ni-Fe Coatings)

    Laser Alloyed Al-Ni-Fe Coatings
    Authors:
    Retha Rossouw, National Metrology Institute of South Africa; Pretoria Southwest Africa
    Sisa Pityana, CSIR National Laser Centre; Pretoria Southwest Africa
    Presented at ICALEO 2008

    The aim of this work was to produce crack-free thin surface layers consisting of binary (Al-Ni, Al-Fe) and ternary (Al-Ni-Fe) intermetallic phases by means of a high power laser beam. The laser surface alloying was carried out by melting Fe and Ni based powders on an aluminium substrate. The mixture of the Fe and Ni powders was varied in order to create Fe-rich and Ni-rich intermetallic phases. A Rofin 4.4 kW Nd: YAG laser was used for melting the powders and the s...

    $28.00

  • ICALEO 2008 Paper #904 (Advancements in Laser Alloying of Aluminum)

    Advancements in Laser Alloying of Aluminum
    Authors:
    Thomas Seefeld, Bias Bremer Institut F Angewandte Strahltechnik Gmbh; Bremen Germany
    Knut Partes, Bias Bremer Institut F Angewandte Strahltechnik Gmbh; Bremen Germany
    Presented at ICALEO 2008

    Since aluminum alloys have very limited resistance to wear, the application of protective surface layers is mandatory to ensure both function and lifetime of aluminum components in many technical applications. Only a small number of effective surface engineering methods are available. Laser alloying using the blown powder method may be a potential candidate for many applications. This paper highlights two different approaches to overcom...

    $28.00

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