ICALEO 2006 Paper #P510 (Laser Cutting of Mineral Pigment Coated Papers)
Laser Cutting of Mineral Pigment Coated Papers
Authors:
Antti Salminen, Lappeenranta University of Technology; Lappeenranta Finland
Heidi Malmberg, Lappeenranta University of Technology; Lappeenranta Finland
Veli Kujanpää, Lappeenranta University of Technology; Lappeenranta Finland
Presented at ICALEO 2006
In 1990´s laser technology increased its volume in papermaking industry. Advantages of laser technology in these branches are flexibility, high speed, contact-free processing and possibilities of multifunctional applications. Anyhow, use of laser technology in papermaking has a minor role, mainly because of shortage of basic research results. Previous laser cuttin...$28.00
ICALEO 2006 Paper #P507 (Precision Adjustment of Spring Contacts Using Laser Forming)
Precision Adjustment of Spring Contacts Using Laser Forming
Authors:
Danny MacCallum, Sandia National Laboratories; Albuquerque NM USA
Gerald Knorovsky, Sandia National Laboratories,; Albuquerque NM USA
Jeremy Palmer, Sandia National Laboratories,; Albuquerque NM USA
Joshua Arvizu, Sandia National Laboratories; Albuquerque NM USA
Presented at ICALEO 2006
Small-lot, precision electrical contact gaps frequently require manual adjustment under a microscope: a time consuming, skilled-operator dependent procedure. Laser forming has been shown effective in bending ~mm-thick, low strength, flat stock steels and is evaluated herein as a high productivity, high pre...$28.00
ICALEO 2006 Paper #P506 (An Analysis of Crack and Porosity Formation in Laser Surface Treated Magnesia Partially Stabilized Zirconia (MgO-PSZ) and Methods for Alleviation)
An Analysis of Crack and Porosity Formation in Laser Surface Treated Magnesia Partially Stabilized Zirconia (MgO-PSZ) and Methods for Alleviation
Authors:
David Evans, Loughborough University; Leicestershire Great Britain
Jonathan Lawrence, Loughborough University; Leicestershire Great Britain
James Kell, Loughborough University; Leicestershire Great Britain
John Tyrer, Loughborough University; Leicestershire Great Britain
Presented at ICALEO 2006
Crack formation during the laser surface treatment of materials with low coefficients of thermal conductivity values, such as ceramics, is one of the most intractable problems encountered in the field of laser ma...$28.00
ICALEO 2006 Paper #P505 (Correction of Distortion and Design Shape in Aluminium Structures using Laser Forming)
Correction of Distortion and Design Shape in Aluminium Structures using Laser Forming
Authors:
Geoff Dearden, The University of Liverpool; Liverpool Great Britain
Stuart Edwardson, The University of Liverpool; Merseyside Great Britain
Emile Abed, The University of Liverpool; Liverpool Great Britain
Ken Watkins, The University of Liverpool; Liverpool Great Britain
Konrad Bartkowiak, Poznan University; Posnan Poland
Presented at ICALEO 2006
The correction of distortion and design shape in manufactured component is increasingly in demand in industry, in particular for aluminium components, where the applications for aluminium and its alloys conti...$28.00
ICALEO 2006 Paper #P503 (Laser Peening Systems for Preventive Maintenance against Stress Corrosion Cracking in Nuclear Power Reactors)
Laser Peening Systems for Preventive Maintenance against Stress Corrosion Cracking in Nuclear Power Reactors
Authors:
Takuya Uehara, Toshiba Co.; Yokohama Japan
Naruhiko Mukai, Toshiba Co.; Yokohama Japan
Masaki Yoda, Toshiba Co.; Yokohama Japan
Yuji Sano, Toshiba Co.; Yokohama Japan
Hiromi Kato, Toshiba Co.; Yokohama Japan
Itaru Chida, Toshiba Co.; Yokohama Japan
Tetsuo Yamamoto, Toshiba Co.; Yokohama Japan
Presented at ICALEO 2006
Laser peening is a surface enhancement process that introduces compressive residual stress on materials by irradiating laser pulses under aqueous environment. The process utilizes the impu...$28.00
ICALEO 2006 Paper #P502 (The Effect of Parameter Changes in CO2 Laser Welding on Spectra)
The Effect of Parameter Changes in CO2 Laser Welding on Spectra
Authors:
Anna Fellman, LUT; Lappeenranta Finland
Antti Salminen, Lappeenranta University of Technology, Department of Mechanical Engineering, Laser processing laboratory; Lappeenranta Finland
Birgitta Martinkauppi, University of Joensuu, Department of Information Technology, InFotonics Center; Joensuu Finland
Jouni Hiltunen, University of Joensuu, Department of Information Technology, InFotonics Center; Joensuu Finland
Ville Heikkinen, University of Joensuu, Department of Information Technology, InFotonics Center; Joensuu Finland
Markku Hauta-Kasari, University of Joensuu, Department o...$28.00
ICALEO 2006 Paper #P501 (Laser Bending of Thin Metal Plate)
Laser Bending of Thin Metal Plate
Authors:
Tadashi Misu, Chiba Ibstitute of Technology; Narashino Japan
Osamu YAMAZAKI, Chiba Ibstitute of Technology; Narashino Japan
Syunrou Yoshioka, Chiba Ibstitute of Technology; Narashino MI Japan
Tsuyoshi Tokunaga, Chiba Ibstitute of Technology; Narashino Japan
Yoshihiro Tanaka, Tokyo Institute Polytechnic Univercity; Kodaira Japan
Toshiyuki MIYAZAKI, japan; Narashino Japan
Presented at ICALEO 2006
Diode laser beams of 10W and 140W are applied to laser forming of stainless steel of about 01 mm in thicknessBeam diameter is about 1 mm so that bending is generated due to buckling mech...$28.00
ICALEO 2006 Paper #M905 (Synova has Re-Invented the Laser: No Heat Damage, No Beam Divergence, No Cutting Gas, No Deposition)
Synova has Re-Invented the Laser: No Heat Damage, No Beam Divergence, No Cutting Gas, No Deposition
Authors:
Delphine Perrottet, Synova SA; Ecublens Switzerland
Joseph Battaglia, Synova USA, Inc.; Santa Cruz CA USA
Bernold Richerzhagen, Synova SA; Ecublens Switzerland
Roy Housh, Synova SA; Ecublens Switzerland
Presented at ICALEO 2006
The innovative water-jet-guided laser technology invented by Synova a few years ago has revolutionized laser microprocessing. With a water jet to guide a laser beam by total internal reflection at the water/air interface, this new technology cannot be confused with a conventional dry laser. In dry laser cutting, the working ...$28.00
ICALEO 2006 Paper #M902 (Advances in Laser Singulation of Silicon)
Advances in Laser Singulation of Silicon
Authors:
Leonard Migliore, Coherent Laser Group; Santa Clara CA USA
Kang-Soo Lee, HBL Corporation; Daejeon South Korea
Kim Jeong-Moog, HBL Corporation; Daejeon South Korea
Choi Byung-Kew, HBL Corporation; Daejeon South Korea
Presented at ICALEO 2006
Individual devices have been saw-cut ("singulated") from wafers since the invention of the integrated circuit. As circuits get smaller and wafers get thinner, however, the limitations of mechanical processes begin to interfere with productivity. Saws tend to chip thin wafers. Newer, more porous "low-k" dielectrics also are prone to chipping when mechanically cut.
At thi...$28.00
ICALEO 2006 Paper #M806 (Metal Micromachining with a New High Average Power Picosecond Pulse Fiber Laser)
Metal Micromachining with a New High Average Power Picosecond Pulse Fiber Laser
Authors:
Jukka Kongas, Corelase OY; Tampere Finland
Mathew Rekow, CTO, Ergolase Inc.; Santa Clara CA USA
Tiina Amberla, Corelase OY; Tampere Finland
Presented at ICALEO 2006
High Power CW fiber laser technology has been developing rapidly and is finding many applications in the industrial sector for metal cutting, welding, heat treatment and more. Recently high average power mode-locked fiber lasers with picosecond pulse lengths and very high repetition rates have begun to appear on the market. Unlike their CW cousins, these lasers pack their energy into pulses that are so short that there ...$28.00
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