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  • ICALEO 2006 Paper #M403 (Laser Drilling of Single Crystal Silicon Carbide Substrates)

    Laser Drilling of Single Crystal Silicon Carbide Substrates
    Authors:
    Aravinda Kar, CREOL, University of Central Florida; Orlando FL USA
    Chong Zhang, CREOL, University of Central Florida; Orlando FL USA
    Nathaniel Quick, AppliCote Associates LLC; Sanford FL USA
    Presented at ICALEO 2006

    SiC is widely used in high temperature and high power microelectronic devices because of its unique thermophysical and electronic properties such as high strength, resistance to chemical degradation and wear resistance at high operating temperatures. These properties also give rise to the difficulties to process SiC with conventional machining methods. Q-switch pulsed Nd: YAG laser (1.06 ...

    $28.00

  • ICALEO 2006 Paper #M402 (Compact QCW Laser Arrays for Use in Demanding Environments)

    Compact QCW Laser Arrays for Use in Demanding Environments
    Authors:
    Rajiv Pathak, Lasertel; Tucson AZ USA
    Chuanshun Cao, Lasertel; Tucson AZ USA
    Jason Helmrich, Lasertel; Tucson AZ USA
    Brian Caliva, Lasertel; Tucson AZ USA
    Feliks Lapinski, Lasertel; Tucson AZ USA
    Prabhu Thiagarajan, Lasertel; Tucson AZ USA
    Robert Walker, Lasertel; Tucson AZ USA
    Mark McElhinney, Lasertel; Tucson AZ USA
    Presented at ICALEO 2006

    Semiconductor lasers operating at 808nm wavelength have found widespread use in many industrial and defense settings, often operating in harsh environments. An example is a demanding Aerospace applic...

    $28.00

  • ICALEO 2006 Paper #M401 (Industrial Applications of Laser Micro/Nano Material Processing)

    Industrial Applications of Laser Micro/Nano Material Processing
    Authors:
    Wenwu Zhang, GE Global Research; Schenectady NY USA
    Long Que, GE GRC; Schenectady NY USA
    Magdi Azer, GE GRC; Schenectady NY USA
    Marshall Jone, GE GRC; Schenectady NY USA
    Pamela Benicewicz, GE GRC; Schenectady NY USA
    Presented at ICALEO 2006

    As a precision and high energy density tool, lasers are being widely used in micro- and nano-scale material processing, such as micro-channel fabrication, micro- hole drilling, embedded micro-fluidics structure direct writing, precision slicing of materials, micro-milling of 3D structures, 3D micro-deposition, and laser assisted select...

    $28.00

  • ICALEO 2006 Paper #M305 (Post Processing of EDM-Machined Microstructures by Ultra Short Pulsed Laser Ablation)

    Post Processing of EDM-Machined Microstructures by Ultra Short Pulsed Laser Ablation
    Authors:
    Sebastian Haupt, wbk - Institute of Production Science; Karlsruhe Germany
    Juergen Fleischer, wbk - Institute of Production Science; Karlsruhe Germany
    Juergen Schmidt, wbk - Institute of Production Science; Karlsruhe Germany
    Presented at ICALEO 2006

    By laser ablation with ultra short laser pulses smallest microstructures with sizes in the micrometer region can be manufactured in hardened steel. However, machining times are slow if good surface qualities are required. Micro-EDM (electrical discharge machining) is also capable of removing material without any process forces but w...

    $28.00

  • ICALEO 2006 Paper #M304 (Patterning of ITO on Glass with Picosecond Lasers for OLEDs)

    Patterning of ITO on Glass with Picosecond Lasers for OLEDs
    Authors:
    Gediminas Raciukaitis, Institute of Physics, Vilnius; Vilnius Lithuania
    Gediminas Darcianovas, Institute of Physics; Vilnius Lithuania
    Marijus Brikas, Institute of Physics; Vilnius Lithuania
    Mindaugas Gedvilas, Institute of Physics; Vilnius Lithuania
    Presented at ICALEO 2006

    Laser direct write technology has been widely used for patterning indium-tin oxide (ITO). It is the main material for making transparent electrodes in electronic devices and flat panel displays. Organic electronics imposes special requirements on geometrical and electrical quality of conductors. Radiation of a high re...

    $28.00

  • ICALEO 2006 Paper #M303 (Picosecond Laser Material Processing - Prospects and Limitations)

    Picosecond Laser Material Processing - Prospects and Limitations
    Authors:
    Ulrich Klug, Laser Zentrum Hannover e.V.; Hannover Germany
    Beatrix Kamlage-Rahn, Laser Zentrum Hannover e.V.; Hannover Germany
    Juergen Koch, Laser Zentrum Hannover e.V.; Hannover Germany
    Ralf Knappe, LUMERA LASER GmbH; Kaiserslautern Germany
    Uwe Stute, Laser Zentrum Hannover e.V.; Hannover Germany
    Boris Chichkov, Laser Zentrum Hannover e.V.; Hannover Germany
    Presented at ICALEO 2006

    Results of experimental investigations on micro machining with a high-repetition rate commercial ps-laser system, focused on the processing quality and efficiency, are presented....

    $28.00

  • ICALEO 2006 Paper #M302 (Modeling of Ultrafast Laser Ablation into Vacuum)

    Modeling of Ultrafast Laser Ablation into Vacuum
    Authors:
    Cho Lik Chan, University of Arizona; Tucson AZ USA
    Mark Squires, University of Arizona; Tucson AZ USA
    Presented at ICALEO 2006

    Laser-matter interaction is a very complicated phenomenon. There exist three principal regimes for laser pulses, namely long, short, and ultrashort pulse lasers. In the ultrashort regime, the target material is ionized more rapidly than the characteristic heat transfer time scale, and the material is ablated without any transfer of heat to the surrounding lattice. The absence of heat transfer to the surrounding lattice provides important advantages to micromachining: reducing both the material proper...

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  • ICALEO 2006 Paper #M206 (1 mJ, Multi-Khz, Sub-500 Fs Diode-Pumped Ytterbium Laser Amplifier)

    1 mJ, Multi-Khz, Sub-500 Fs Diode-Pumped Ytterbium Laser Amplifier
    Authors:
    Antoine Courjaud, Amplitude Systemes; Pessac France
    Clemens Hoenninger, Amplitude Systemes; Pessac France
    Eric Mottay, Amplitude Systemes; Pessac France
    Inka Manek-Hoenninger, University Bordeaux 1; Talence France
    Martin Delaigue, University Bordeaux 1; Talence France
    Presented at ICALEO 2006

    Precision micro machining in an industrial environment demands stable and high performance femtosecond lasers. Up to now most femtosecond amplified systems delivering mJ pulse energies are based on Ti:sapphire as gain medium which require rather complex pump lasers. We demonstrate...

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  • ICALEO 2006 Paper #M205 (Microstructures on Metal Plate Produced with Femtosecond Laser)

    Microstructures on Metal Plate Produced with Femtosecond Laser
    Authors:
    Masahiro Tsukmoto, Joining and Welding Research Institute, Osaka Univversity; Ibaraki Japan
    Nobuyuki Abe, Joining and Welding Research Institute, Osaka Univversity; Ibaraki Japan
    Yuichi Komizo, Joining and Welding Research Institute, Osaka Univversity; Ibaraki Japan
    Keita Asuka, Graduate School of Engineering, Osaka University; Suita Japan
    Masayuki Fujita, Institute for Laser Technology; Suita Japan
    Masaki Hashida, Institute for Chemical Research, Kyoto University; Uji Japan
    Hitoshi Nakano, School of Engineering, Kinki University; Higashi-Osaka Japan
    M...

    $28.00

  • ICALEO 2006 Paper #M204 (High Energy Diode-Pumped Femtosecond Oscillator with 1 µJ Pulse Energy at 9 Mhz Pulse Repetition Rate)

    High Energy Diode-Pumped Femtosecond Oscillator with 1 µJ Pulse Energy at 9 Mhz Pulse Repetition Rate
    Authors:
    Clemens Hoenninger, Amplitude Systemes; Pessac France
    Eric Mottay, Amplitude Systemes; Pessac France
    Presented at ICALEO 2006

    High energy femtosecond oscillators at high pulse repetition rate have a great potential for many applications such as micro- and nano-machining and structuring, waveguide writing in dielectric media, or nonlinear frequency conversion. Up to now most femtosecond oscillators operating at pulse repetition rates higher than 1 MHz were limited at pulse energies of typically a few tens of nanoJoules. We demonstrate a directly diode-pumped Yb:KYW laser o...

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