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  • ICALEO 2005 Paper #P515 (Nd:YAG Laser Welding of AA6061: Experimental Differences Between the Tee and Lap Joint Configurations)

    Nd:YAG Laser Welding of AA6061: Experimental Differences Between the Tee and Lap Joint Configurations
    Authors:
    Laurent Dubourg, Aluminum Technologies Centre - NRC; Chicoutimi Quebec Canada
    Presented at ICALEO 2005

    Effect of laser welding parameters such as power, out-of-focus length, welding speed and feeding speed on weld properties are studied in tee and lap configurations. Two millimetre thick plates of AA6061 were welded in Tee joint configuration using a cw/Nd:YAG laser and AA5356 wire as the filler metal. The same set-up and wire feeding were used for the lap joining of two millimetre thick square tubes and plates of AA6061. Combination of Taguchi and E.M. design of experiments was carrie...

    $28.00

  • ICALEO 2005 Paper #P514 (Laser Consolidation of H13 Tool Steel)

    Laser Consolidation of H13 Tool Steel
    Authors:
    Lijue Xue, National Research Council Canada; London ON Canada
    Andre Theriault, National Research Council Canada; London Ontario Canada
    Sheng-Hui Wang, National Research Council Canada; London Ontario Canada
    Jianyin Chen, National Research Council Canada; London Ontario Canada
    Presented at ICALEO 2005

    Laser consolidation (LC) is an innovative one-step material addition process. Based on CAD design, the process builds net shape functional parts or features on existing components layer-by-layer by using a laser beam to melt injected powder and re-solidifying it onto a substrate. In this paper, investigation of L...

    $28.00

  • ICALEO 2005 Paper #P513 (Laser Processing of Solder Prevention Coating)

    Laser Processing of Solder Prevention Coating
    Authors:
    Antti Salminen, Lappeenranta University of Technology; Lappeenranta Finland
    Tony Vesterinen, Lappeenranta University of Technology; Lappeenranta Finland
    Presented at ICALEO 2005

    The last work phase of PCB manufacture prior installation of components is to remove the solder prevention paint and to reveal the positions in which the components will be connected. Traditionally this is carried out with etching, which is a chemical process. This work concentrates on removal of this coating with laser processing. Different lasers were tested in this task and laser showed to be accurate, flexible and fast tool for doing this work. Nd:Y...

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  • ICALEO 2005 Paper #P510 (Residual Stresses in HPDL and Nd:YAG Laser Cladded Coatings)

    Residual Stresses in HPDL and Nd:YAG Laser Cladded Coatings
    Authors:
    Jari Tuominen, Tampere University of Technology, Institute of Materials Science; Tampere Pirkanmaa Finland
    Petri Vuoristo, Tampere University of Technology, Institute of Materials Science; Tampere Pirkanmaa Finland
    Tapio MylTampere University of Technology, Institute of Materials Science; Tampere Pirkanmaa Finland
    Presented at ICALEO 2005

    Applying laser cladded components in expensive machines and engines requires knowledge of residual stresses in order to avoid unexpected failures and further damages. Normally residual stresses induced by laser cladding are highly tensile due to strong thermal ...

    $28.00

  • ICALEO 2005 Paper #P508 (Corrosion Properties of Thermally Sprayed In-Situ Laser Remelted Ni-Based Coatings)

    Corrosion Properties of Thermally Sprayed In-Situ Laser Remelted Ni-Based Coatings
    Authors:
    Jyrki Suutala, Tampere University of Technology; Tampere Finland
    Jari Tuominen, Tampere University of Technology; Tampere Pirkanmaa Finnland
    Petri Vuoristo, Tampere University of Technology; Tampere Finland
    Presented at ICALEO 2005

    In the present study, surface engineering research related to thermally sprayed Ni-based corrosion resistant coatings modified by in-situ and post treatment by novel high power lasers (Nd:YAG and diode lasers) has been carried out. The main aim of the study was to create experimental based information and knowledge on simultaneous remelting of thermal...

    $28.00

  • ICALEO 2005 Paper #P507 (Laser Surface Melting of High-Speed Steels for Enhancing Surface Properties)

    Laser Surface Melting of High-Speed Steels for Enhancing Surface Properties
    Authors:
    Hau Chung Man, Laser Processing Group, Advanced Manufacturing Technology Research Centre; Kowloon Hong Kong
    Presented at ICALEO 2005

    Two high-speed steels (HSS), ASP23 and ASP30 formed by powder metallurgy, have similar chemical compositions (Fe-4.2wt%Cr-6.4wt%W-5wt%Mo-3.1wt%V-1.3wt%C), but with ASP30 containing 8.5% Co, were surface remelted by a 2.5-kW Nd:YAG laser. Metallographical, X-ray diffraction, microhardness, as well as electrochemical corrosion studies illustrate the beneficial effects of laser surface melting (LSM) in enhancing the surface properties of the HSS. The laser-melted zone of the HSS cons...

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  • ICALEO 2005 Paper #P501 (Studies of Frequency-Tripled Nd:YAG Laser in Laser Structuring Process)

    Studies of Frequency-Tripled Nd:YAG Laser in Laser Structuring Process
    Authors:
    Bin Zhang, Hong Kong Poly University; Hong Kong
    K.C. Yung, Hong Kong Poly University; Hong Kong
    Presented at ICALEO 2005

    With the increasing demand for finer lines/spaces on PCB boards, a new technology ?laser structuring ? has emerged in recent years. In this research, the frequency-tripled Nd:YAG laser is selected as the laser source in laser structuring; this laser is often used in miniaturization machining. This paper describes in detail the processing parameters? influences of lasers and etching process, such as laser power, repetitions, repetition rate, bite size and etching time, on laser st...

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  • ICALEO 2005 Paper #M808 (Direct-patterning of Silicon Carbide by Nanosphere-Assisted Pulsed Laser)

    Direct-patterning of Silicon Carbide by Nanosphere-Assisted Pulsed Laser
    Authors:
    Arvind Battula, University of Texas at Austin; Austin TX USA
    Senthil Theppakuttai, The University of Texas at Austin; Austin TX USA
    Shaochen Chen, The University of Texas at Austin; Austin TX USA
    Presented at ICALEO 2005

    Optical near-field enhancement obtained between the spheres and substrate by irradiating with laser beam can be used for nano-patterning the hard-to-machine bulk silicon carbide (SiC). For this study a monolayer of silica (SiO2) spheres of 1.76 micorn and 640 nm diameter are deposited on the SiC substrate and then irradiated with an Nd:YAG laser of wavelength 355 nm and 5...

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  • ICALEO 2005 Paper #M807 (Laser Exposure System for Flat Panel Display Industry)

    Laser Exposure System for Flat Panel Display Industry
    Authors:
    Kim Kwang-Ryul, LG Electronics Inc.; Pyungtaek, Kyunggido Korea
    Yong-Woo Lee, LG Electronics Inc.; Pyungtaek, Kyunggido Korea
    Hye-Won Kim, LG Electronics Inc.; Pyungtaek, Kyunggido Korea
    In-Tae Park, LG Electronics Inc.; Pyungtaek, Kyunggido Korea
    Hyoung-Shik Kang, LG Electronics Inc.; Pyungtaek, Kyunggido Korea
    Sang-Bong Lee, LG Electronics Inc.
    LG Electronics Inc.; Pyungtaek, Kyunggido Korea

    Soon-Kook Hong, LG Electronics Inc.; Pyungtaek, Kyunggido Korea
    Presented at ICALEO 2005

    When screen size of the Flat Panel Display (FPD) becomes larger, the tradit...

    $28.00

  • ICALEO 2005 Paper #M804 (Cutting Flexible Printed Circuit Board with a 532nm Q-Switched Diode Pumped Solid State Laser)

    Cutting Flexible Printed Circuit Board with a 532nm Q-Switched Diode Pumped Solid State Laser
    Authors:
    Matt Henry, Powerlase Ltd; Crawley Great Britain
    Jozef Wendland, Powerlase Ltd; Crawley West Sussex UK
    Paul Harrison, Powerlase Ltd; Crawley West Sussex UK
    Duncan Parsons-Karavassilis, Powerlase Ltd; Crawley West Sussex UK
    Presented at ICALEO 2005

    The authors investigate the high speed laser cutting of flexible printed circuit boards (PCBs) using a low M2 532nm to create features >40 microns in size.
    The use of flexible PCBs in portable electronics devices such as laptops, PDAs and mobile phones is increasing as such material offers advantages in terms o...

    $28.00

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