ICALEO 2013 Paper #M203 (High Throughput Surface Structuring with Ultrashort Pulses in Synchronized Mode with Fast Polygon Line Scanner)

High Throughput Surface Structuring with Ultrashort Pulses in Synchronized Mode with Fast Polygon Line Scanner
Authors:
Beat Neuenschwander, Bern University of Applied Sciences; Burgdorf Switzerland
Beat Jaeggi, Bern University of Applied Sciences Engineering and Information Technology; Burgdorf Switzerland
Markus Zimmermann, Bern University of Applied Sciences Engineering and Information Technology; Burgdorf Switzerland
Lars Penning, Next Scan Technology Bv; Bd Silvolde Netherlands
Ronny De Loor, Next Scan Technology Bv; Bd Silvolde Netherlands
Kurt Weingareten, Time Bandwidth Products Ag; Zuerich Switzerland
Andreas Oehler, Time Band...

ICALEO 2013 Paper #M202 (Parallel Femtosecond Laser Processing using Intensity Modulated Diffraction Pattern Produced with Spatial Light Modulator)

Parallel Femtosecond Laser Processing using Intensity Modulated Diffraction Pattern Produced with Spatial Light Modulator
Authors:
Jarno Kaakkunen, VTT Technical Research Centre of Finland; Lappeenranta Finland
Martti Silvennoinen, University of Eastern Finland, Department of Physics and Mathematics; Joensuu Finland
Kimmo Paivasaari, University of Eastern Finland, Department of Physics and Mathematics; Joensuu Finland
Petri Laakso, VTT Technical Research Centre of Finland; Lappeenranta Finland
Pasi Vahimaa, University of Eastern Finland, Department of Physics and Mathematics; Joensuu Finland
Presented at ICALEO 2013

Due to technical developmen...

ICALEO 2013 Paper #M201 (Dicing of Thin Si Wafers with a Picosecond Laser Ablation Process)

Dicing of Thin Si Wafers with a Picosecond Laser Ablation Process
Authors:
Christian Fornaroli, Fraunhofer ILT; Aachen Germany
Jens Holtkamp, Fraunhofer Ilt; Aachen
Arnold Gillner, Fraunhofer Ilt; Aachen
Presented at ICALEO 2013

These days common way to produce electrical components like LEDs or computer chips is a batch process. Therefore a lot of identical components are processed parallel on one big wafer and
eventually each chip has to be singulated. Mechanical sawing with diamond blades have been used for a long time but as the wafer material is
getting thinner and the chip size smaller, this classical process is replaced by laser based dicing processes. Esp...

ICALEO 2013 Paper #M101 (Micro Scale Laser Based Additive Manufacturing for Metals)

Micro Scale Laser Based Additive Manufacturing for Metals
Authors:
Maximilian Schniednharm, Chair for Laser Technology LLT; Aachen
Matthias Belting, Fraunhofer Institute for Laser Technology Ilt; Aachen
Rui Joao, Fraunhofer Institute for Laser Technology Ilt; Aachen
Wilheim Meiners, Fraunhofer Institute for Laser Technology Ilt; Aachen
Andreas Weisheit, Fraunhofer Institute for Laser Technology Ilt; Aachen
Presented at ICALEO 2013

TBA

ICALEO 2013 Paper #M1005 (Large Angle of Bragg Diffraction Using Interference Of Acoustic Wave Inside Acousto-Optic Deflector)

Large Angle of Bragg Diffraction Using Interference Of Acoustic Wave Inside Acousto-Optic Deflector
Authors:
Tiansi Wang, Creol, the College of Optics & Photonics, University of Central Florida, University of Central Florida; Orlando FL USA
Chong Zhang, Intel - Assembly & Test Technology Development; Chandler AZ USA
Islam Salama, Intel - Assembly & Test Technology Development; Chandler AZ USA
Aleksandar Aleksov, Intel Components Research; Chandler AZ USA
Aravinda Kar, Mechanical and Aeronautical Eng., and Mat. Sci. and Eng. Department, University of Central Florida; Orlando FL USA
Presented at ICALEO 2013

Abstract

The laser beam is ofte...

ICALEO 2013 Paper #M1004 (From Fs - Ns: Influence of the Pulse Duration Onto the Material Removal Rate and Machining Quality for Metals)

From Fs – Ns: Influence of the Pulse Duration Onto the Material Removal Rate and Machining Quality for Metals
Authors:
Benjamin Lauer, Bern University of Applied Sciences Engineering and Information Technology; Burgdorf Switzerland
Beat Jaeggi, Bern University of Applied Sciences Engineering and Information Technology; Burgdorf Switzerland
Marc Schmid, Bern University of Applied Sciences Engineering and Information Technology; Burgdorf Switzerland
Beat Neuenschwander, Bern University of Applied Sciences; Burgdorf Switzerland
Presented at ICALEO 2013

When high requirements concerning machining quality are demanded, ultra short laser pulses from a few 100f...

ICALEO 2013 Paper #M1002 (Experimental Investigation of Cfrp Ablation with Uv and N-Ir Nanosecond Lasers)

Experimental Investigation of Cfrp Ablation with Uv and N-Ir Nanosecond Lasers
Authors:
Yuji Sato, Joining and Welding Reserach Institute, Osaka University; Osaka Japan
Masahiro Tsukamoto, Joining and Welding Reserach Institute, Osaka University; Osaka Japan
Kenjiro Takahashi, Joining and Welding Reserach Institute, Osaka University; Osaka Japan
Shin-Ichiro Masuno, Joining and Welding Reserach Institute, Osaka University; Osaka Japan
Kazuki Nakai, Joining and Welding Reserach Institute, Osaka University; Osaka Japan
Tatsuya Nariyama, Kinki University; Osaka
Hitoshi Nakano, Kinki University; Osaka Japan
Presented at ICALEO 20...

ICALEO 2013 Paper #M1001 (Comparison Between Laser Technologies and Alternative Processes on Paint and Polymer Layer Removal on Composite Substrate)

Comparison Between Laser Technologies and Alternative Processes on Paint and Polymer Layer Removal on Composite Substrate
Authors:
Charly Loumena, Alphanov; Talence France
Anthony Kirsch, Alphanov; Talence France
Rainer Kling, Alphanov; Talence Cedex France
Presented at ICALEO 2013

The application of composites and in particular CFRP (Carbon Fiber Reinforced Polymer) is a booming market. This material tends to gradually replace metals and alloys in many fields such as automotive, renewable energies, and aerospace. Indeed, composite materials combine high mechanical performances, low weight and good corrosion resistance. However this highly technical material requires ...

ICALEO 2013 Paper #C103 (Additive Manufacturing In Micro Scale)

Additive Manufacturing In Micro Scale
Authors:
Christian Noelke, Laser Zentrum Hannover e.V.; Hannover Germany
Matthias Gieseke, Laser Zentrum Hannover e.V.; Hannover Germany
Stefan Kaierle, Laser Zentrum Hannover e.V.; Hannover Germany
Presented at ICALEO 2013

Additive manufacturing is getting increasingly attractive for industrial production of unique or small series parts. Since a lot industrial metals like titanium and aluminum are established in AM processes, increasing the resolution within these processes is the next challenge. The aim is not only the production of micro-sized parts or important details, there is also a request to achieve ready to use surface qu...

ICALEO 2013 Paper #906 (Study of Filler Metal Mixing and Its Implication on Weld Homogeneity of Laser-Hybrid and Laser Cold-Wire Welded Thick Austenitic Stainless Steel Joints)

Study of Filler Metal Mixing and Its Implication on Weld Homogeneity of Laser-Hybrid and Laser Cold-Wire Welded Thick Austenitic Stainless Steel Joints
Authors:
Miikka Karhu, VTT Technical Research Centre of Finland; Lappeenranta Finland
Veli Kujanpaaa, Vtt Technical Research Centre of Finland; Lappeenranta Finland
Andrey Gumenyuk, Bam - Federal Institute for Materials Research and Testing, Berlin, Germany; Berlin Germany
Marco Lammers, Bam - Federal Institute for Materials Research and Testing, Berlin, Germany; Berlin Germany
Presented at ICALEO 2013

Austenitic stainless steel AISI 316L grade base material with butt joint thicknesses of 10-15 mm and diffe...