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  • ICALEO 2010 Paper #M903 (Mixed Mode Ablation Used for Improvements in Laser Machining)

    Mixed Mode Ablation Used for Improvements in Laser Machining
    Authors:
    E. Gounaris, Connecticut Center for Advanced Technology, National Center for Aerospace Leadership; East Hartford CT USA
    Dan Casioppo, Lehigh University; Bethlehem PA USA
    P. Denney, Connecticut Center for Advanced Technology; East Hartford CT USA
    Presented at ICALEO 2010

    As the average power for short pulsed lasers (femto-, pico- and nano- second pulse durations) increases, it may be economical to transition from micro to macro laser machining applications. Removal rates have usually been driven by parameters that meet a given surface finish and/or dimension requirement that can be achieved with a gi...

    $28.00

  • ICALEO 2010 Paper #M902 (High Speed Laser Cutting of Electrodes for Advanced Batteries)

    High Speed Laser Cutting of Electrodes for Advanced Batteries
    Authors:
    Jyoti Mazumder, University of Michigan; Ann Arbor MI USA
    Mehrdad Iravani, University of Michigan; Ann Arbor
    Hans Herfurth, Fraunhofer Usa; Plymouth MI USA
    Henrikki Pantsar, Fraunhofer Usa; Plymouth MI USA
    Rahul Patwa, Fraunhofer USA; PLYMOUTH MI USA
    Stefan Heinemann, Fraunhofer Usa; Plymouth MI USA
    Presented at ICALEO 2010

    Lithium-ion batteries are at the forefront of current advanced battery technology development for Hybrid-Electric Vehicles. While first vehicles with Li-ion batteries are entering the market, it is understood that significant technology adv...

    $28.00

  • ICALEO 2010 Paper #M901 (Micro-Cutting with Nanosecond Pulsed Fiber Lasers)

    Micro-Cutting with Nanosecond Pulsed Fiber Lasers
    Authors:
    Jack Gabzdyl, Spi Lasers UK Limited; Southampton Great Britain
    Mark Brodsky, SPI Lasers LLC; Santa Clara CA USA
    Presented at ICALEO 2010

    Nanosecond pulsed fiber lasers have made a significant impact in the material marking arena, but as laser sources they are proving to be extremely versatile finding many applications in a variety of micro-machining processes. One such process is micro-cutting.

    Until recently high precision micro cutting has been the domain of DPSS pulsed lasers and CW-M fiber lasers, as epitomised by applications such as electronic stencil and medical stent cutting. However the short high peak power pul...

    $28.00

  • ICALEO 2010 Paper #M804 (Laser Scribing of Stainless Steel with and Without Work Media)

    Laser Scribing of Stainless Steel with and Without Work Media
    Authors:
    Anna Unt, Lappeenranta University of Technology, Laser Processing Technology Research Group, Faculty of Technology; Lappeenranta Finland
    Heidi Piili, PRESENTER NOT AUTHOR, Lappeenranta University of Technology, Laser Processing Technology Research Group, Faculty of Technology; Lappeenranta Finland
    Marika HirvimäKi, Lappeenranta University of Technology, Laser Processing Technology Research Group, Faculty of Technology; Lappeenranta Finland
    Matti Manninen, Lappeenranta University of Technology, Laser Processing Technology Research Group, Faculty of Technology; Lappeenranta
    Antti Salminen, L...

    $28.00

  • ICALEO 2010 Paper #M802 (3D-Microstructuring of Sapphire using High Power Fs-Laser Radiation and Selective Etching)

    3D-Microstructuring of Sapphire using High Power Fs-Laser Radiation and Selective Etching
    Authors:
    Maren Hörstmann-Jungemannn, Lehrstuhl Fuer Lasertechnik (LLT), RWTH Aachen University; Aachen Germany
    Jens Gottmann, Lehrstuhl Fuer Lasertechnik (LLT), RWTH Aachen University; Aachen Germany
    Presented at ICALEO 2010

    Micro structuring of sapphire and fused silica is an important market e.g. for microfluidic devices and sensors that combine optical and microfluidic features, freeform microlense systems as well as micromechanical parts. New techniques which enable more material and time efficient processing of sapphire and fused silica are requested.
    The In-volume Selective Laser Etch...

    $28.00

  • ICALEO 2010 Paper #M801 (Laser Micromachining of Silicon Substrates: Investigation and Utilisation of Assist Media (Invited Presentation))

    Laser Micromachining of Silicon Substrates: Investigation and Utilisation of Assist Media (Invited Presentation)
    Authors:
    Alan Conneely, National Centre of Laser Applications, School of Physics, National University of Ireland Galway; Galway Ireland
    Sedao -, National Centre of Laser Applications, School of Physics, National University of Ireland Galway; -
    Natalie Haustrup, National Centre of Laser Applications, School of Physics, National University of Ireland Galway; -
    Gerard OConnor, National Centre of Laser Applications, School of Physics, National University of Ireland Galway; -
    Presented at ICALEO 2010

    The use of Short and Ultrashort pulse lasers...

    $28.00

  • ICALEO 2010 Paper #M706 (Micromachining of Glassy Carbon Toolsets for Micro Embossing Applications)

    Micromachining of Glassy Carbon Toolsets for Micro Embossing Applications
    Authors:
    Pranav Chopra, Institute for Manufacturing, University of Cambridge; Cambridge Great Britain
    Kun Li, Institute for Manufacturing, University of Cambridge; Cambridge
    William O'Neill, Institute for Manufacturing, University of Cambridge; Cambridge Great Britain
    Jack Gabzdyl, Spi Laser; Southampton Great Britain
    Presented at ICALEO 2010

    Glassy carbon materials offer advantages in the application of toolsets for micro embossing due to their particular material properties of high hardness, high operating temperatures and high chemical inertness. Such properties also render them...

    $28.00

  • ICALEO 2010 Paper #M705 (Design of a Microdistillation Column)

    Design of a Microdistillation Column
    Authors:
    Matti Manninen, Lappeenranta University of Technology, Laser Processing Technology Research Group; Lappeenranta Finland
    Aarne Sundberg, Aalto University, Department of Biotechnology and Chemical Technology, Faculty of Chemistry and Materials; Espoo Finland
    Heidi Piili, Lappeenranta University of Technology, Laser Processing Technology Research Group; Lappeenranta Finland
    Antti Salminen, Machine Technology Centre Turku Ltd.; Turku Finland
    Presented at ICALEO 2010

    Laser microprocessing is one of the fastest spreading and developing areas of all laser processes in the world. In the wide field of micromachining the...

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  • ICALEO 2010 Paper #M703 (Multi-Wavelength Micromachining of Silicon and Glass by Q-Switched Short Pulsed Lasers)

    Multi-Wavelength Micromachining of Silicon and Glass by Q-Switched Short Pulsed Lasers
    Authors:
    Shiva Gadag, Center for Laser Aided Manufacturing, Southern Methodist University; Dallas TX USA
    Radovan Kovacevic, Center for Laser Aided Manufacturing, Southern Methodist University; Dallas TX USA
    Presented at ICALEO 2010

    Laser Micromachining of semiconductor materials - Silicon wafers, glass and quartz are experimentally investigated using the Spectra Physics diode pumped solid state laser. The Q-switched Nd:YVO4 DPSS laser of fundamental wavelength 1064 nm with high pulsing frequencies (15 300 kHz) and short pulse duration (10 ns) is used for micromachining. Laser drilling of arra...

    $28.00

  • ICALEO 2010 Paper #M702 (Suppression of Laser Plasma Melting Side Walls in Laser Drilling High Aspect Ratio Microvias)

    Suppression of Laser Plasma Melting Side Walls in Laser Drilling High Aspect Ratio Microvias
    Authors:
    V.N. TOKAREV, A.M.Prokhorov General Physics Institute, Russian Academy of Sciences; Moscow Russia
    V.A. Shmakov, A.M. Prokhorov General Physics Institute, Russian Academy of Sciences; Moscow Russia
    V.A. Yamschikov, Institute of Electrophysics and Energetics, Russian Academy of Sciences; Sankt-Peterburg Russia
    R.R. Khasaya, Institute for Electrophysics and Electric Power, Russian Academy of Sciences; Sankt-Peterburg Russia
    S.I. Mikolutski, Institute for Electrophysics and Electric Power, Russian Academy of Sciences; Sankt-Peterburg Russia
    Vladislav K...

    $28.00

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