Product Code: ICAL05_M802

Laser Microtechnologies for Passive Elements of Electronic Circuits
Authors:
Ryszard Pawlak, Technical University of Lodz, Division of Materials Science & Electrotechnology; Lodz Poland
Franciszek Kostrubiec, Technical University of Lodz, Division of Materials Science & Electrotechnology; Lodz Poland
Maria Walczak, Technical University of Lodz, Division of Materials Science & Electrotechnology; Lodz Poland
Mariusz Tomczyk, Technical University of Lodz, Division of Materials Science & Electrotechnology; Lodz Poland
Presented at ICALEO 2005

Varied innovative laser-technologies introduced to manufacturing process of electronic circuits and devices were applied to semiconductor and dielectric materials. As distinct from this we have investigated some laser microtechnologies concerning electrically conductive materials and elements made of them. Laser technologies such as microremelting and microalloying of thin wires and metallic foils as well as microwelding and material removing were applied for creating of a new type of conductive elements. These elements containing micro-areas of form, dimensions and materials properties, especially high electrical resistivity, determined by applying of laser microtechnology, could be use as new generation of miniature fuse links. The problems of heat and mass transfer specific to remelting and alloying of elements of microscopic dimensions were investigated by computer modeling. The results of investigations into materials, electrical and thermal properties of modified elements are discussed with reference to results of experimental utilization of elements manufactured by means of laser technologies.