Product Code: ICAL08_M102

Debris-free Laser Dicing for Multi-layered Mems
Authors:
Masayuki Fujita, Institute for Laser Technology; Suita Japan
Yusaku Izawa, Institute of Laser Engineering, Osaka University; Suita Japan
Yosuke Tsurumi, Institute of Laser Engineering, Osaka University; Suita Japan
Shuji Tanaka, Department of Nano-Mechanics, Tohoku University; Sendai Japan
Hideyuki Fukushi, Department of Nano-Mechanics, Tohoku University; Sendai Japan
Keiichi Sueda, Institute of Laser Engineering, Osaka University; Suita Japan
Yoshiki Nakata, Institute of Laser Engineering, Osaka University; Suita Japan
Noriaki Miyanaga, Institute of Laser Engineering, Osaka University; Suita Japan
Masayoshi Esashi, Department of Nano-Mechanics, Tohoku University; Sendai Japan
Presented at ICALEO 2008

We have developed a novel debris-free in-air laser dicing technology, which gives more design freedoms in the structure, process and materials of MEMS as well as improves yields. Our technology combines two processes: dicing guide fabrication and wafer separation process. The first process is the internal transformation using a fundamental wavelength of a Nd:YAG laser. The second process is non-contact separation by thermally-induced crack propagation using a CO2 laser or mechanical separation by bending stress. The 10 ns Nd:YAG laser can form the internal transformation both in glass and silicon. The internal transformed lines worked as a guide of the separation. The diced line completely followed the internal transformation by thermally induced crack propagation. The double layer wafer consisting of glass and silicon can be diced in low stress by our technology.