Product Code: ICA11_N106

Micromachining of Micropillar Array Chip on PI and PMMA Substrate with Excimer Laser Ablation
Authors:
Xuefei Shen, Beijing University of Technology; Beijing Peoples Republic of China
Tao Chen, Beijing University of Technology; -
Ning Liu, Beijing University of Technology; -
Qing Zhang, Beijing University of Technology; -
Presented at ICALEO 2011

Abstract: In this study, the fabrication of microfluidic chip containing a row of 198 micropillars was described. The chips were used to separate cells. The geometric deformation of micropillars in microfluidic chip on the PI and PMMA substrates micromachining was caused by cumulative heat during laser ablation. Analysis of the cumulative heat effect of PI (polyimide) and PMMA was done (polymethyl methacrylate) when ablated using a KrF excimer laser for microfluidic. We researched the variation of micropillars geometric deformation on the different fluence and the number of laser pulses according to experimental observations. The number of laser pulses generates a greater geometric deformation in PMMA than in PI. The diameter of the top of micropillars increase is attributed to a smaller thermal expansion coefficient of PI that enables a smaller melted volume to form. In connection with PI, The relation between the laser pulses and the top and bottom diameter of the micropillars has been got. The cause has been analyzed.