Product Code: JLA_22_2_48

Authors:
M. Baumeister
T. Scholz
K. Dickmann
Laser Center University of Applied Sciences Muenster (LFM), Stegerwaldstrasse 39, Steinfurt 48565, Germany

F. Vollersten
Bremer Institut fuer Angewandte Strahltechnik (BIAS) GmbH, Klagenfurter Strasse 2, Bremen 28359, Germany

High-speed laser micro-perforation (“on-the-fly” technique) represents a processing technique for the time-efficient and cost-effective production of microsieves. In order to increase the perforation rate this process is researched with use of a brilliant laser source. These laser sources combine ample output power with an excellent beam quality. The high perforation rate [<50 000 drillings/s, laser source: YLR-300SM (IPG)], which can be achieved with this technique makes it an attractive option for the creation of large drilling matrices and drilling widths of less than 15 μm. The described experimental work is carried out to validate a theoretical analysis of the maximum obtainable perforation rate and its main influencing factors. It was found that Mie-scattering represents a crucial factor for the whole process with respect to the application of a brilliant laser source.