Product Code: PIC2008_104

Study on the Machining Process of a New Laser Crack-Free Cutting Technique for Ceramics
Authors:
Lingfei Ji, Institute of Laser Engineering, Beijing University of Technology; Beijing Peoples Republic of China
Yinzhou Yan, Institute of Laser Engineering, Beijing University of Technology; Beijing Peoples Republic of China
Yong Bao, Institute of Laser Engineering, Beijing University of Technology; Beijing Peoples Republic of China
Yijian Jiang, Institute of Laser Engineering, Beijing University of Technology; Beijing Peoples Republic of China
Presented at PICALO 2008

Research on laser crack-free cutting of ceramics, especially for the thicker workpieces, has always been paid great attention. This paper presents initial research results of a new laser crack-free cutting technique capable of cutting ceramics with thickness can be > 10 mm in internal straight or curve trajectory by Slab CO2 laser at higher cutting speed of about 25 ~ 30 mm/min.
The technique is originated from the laser continuous piercing full through the workpieces but need appropriate time shot for every piercing and other adaptation on processing steps, cycle duty and gas pressure and so on. With low frequency of 30~50 Hz, piercing time of 0.1~0.5 s and piercing pitch of about 0.03~0.05 mm in pulse mode operation, crack-free laser cutting of ceramics can be achieved. Additionally, low duty cycle < 30% is also helpful to improve the cutting quality by reliving noticeable heat accumulation. The results of the study show the laser crack-free cutting technique can be a feasible tool for successful cutting of ceramics in complex path, even for 3D cutting.