ICALEO 2009 Paper #M301 (Laser Internal Modification plus Wet Etching for Micro-structuring Crystalline and Glassy Materials (Invited Presentation, 40 minutes))

Laser Internal Modification plus Wet Etching for Micro-structuring Crystalline and Glassy Materials (Invited Presentation, 40 minutes)
Authors:
Shigeki Matsuo, The University of Tokushima; Tokushima Japan
Presented at ICALEO 2009

Thanks to the recent progress in femtosecond (fs) laser technology, now fs laser is regarded as a powerful tool for micro/nano processing of materials. We apply fs lasers to three-dimensional (3D) removal processing inside transparent solid. The procedure of this processing consists of two steps. The first step is irradiation of focused fs pulses, which results in a modification of host material in the vicinity of the focus. By moving the sample, modified spots are...

ICALEO 2009 Paper #M302 (Micro Structuring of Sapphire and Fused Silica by High Speed and High Precision In-volume Selective Laser Etching)

Micro Structuring of Sapphire and Fused Silica by High Speed and High Precision In-volume Selective Laser Etching
Authors:
Martin Hermans, Lehrstuhl Fuer Lasertechnik Rwth Aachen University; Aachen Germany
Jens Gottmann, Lehrstuhl Fuer Lasertechnik Rwth Aachen University; Aachen Germany
Maren Hoerstmann-Jungemann, Lehrstuhl Fuer Lasertechnik Rwth Aachen University; Aachen Germany
Philipp Kramer, Lehrstuhl fur Lasertechnik, RWTH Aachen University; Aachen Germany
Presented at ICALEO 2009

Micro structuring of sapphire and fused silica is an important market e.g. the production of microfluidic devices and sensors that combine optical and microfluidic functions...

ICALEO 2009 Paper #M303 (Spatial Micro-Processing of Mono-Crystallin Silicon with Hybrid Chemical-Laser Etching Method in KOH with the Use of Fiber Laser)

Spatial Micro-Processing of Mono-Crystallin Silicon with Hybrid Chemical–Laser Etching Method in KOH with the Use of Fiber Laser
Authors:
Adam Rosowski, Technical University of Lodz; Lodz Poland
Heidi Piili, Lappeenranta University of Technology; Lappeenranta Finland
Ryszard Pawlak, Technical University of Lodz; Lodz Poland
Veli Kujanpaa, Lappeenranta University of Technology and VTT; Lappeenranta Finland
Antti Salminen, Lappeenranta University of Technology; Lappeenranta Finland
Presented at ICALEO 2009

This study presents a hybrid technology of chemical and laser spatial processing (HCL) for spatial micro-processing of monocrystalline sili...

ICALEO 2009 Paper #M304 (Debris-free Low-stress Laser Dicing for Multi-layered MEMS Wafer)

Debris-free Low-stress Laser Dicing for Multi-layered MEMS Wafer
Authors:
Masayuki Fujita, Institute for Laser Technology; Osaka Japan
Yusaku Izawa, Institute of Laser Engineering, Osaka University; Suita Japan
Yosuke Tsurumi, Institute of Laser Engineering, Osaka University; Suita Japan
Shuji Tanaka, Tohoku University; Sendai Japan
Hideyuki Fukushi, Tohoku University; Sendai Japan
Keiichi Sueda, Institute of Laser Engineering, Osaka University; Suita Japan
Yoshiki Nakata, Institute of Laser Engineering, Osaka University; Suita Japan
Noriaki Miyanaga, Institute of Laser Engineering, Osaka University; Suita Japan
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ICALEO 2009 Paper #M305 (Analytical Model for CW-Laser Cleaving of Semiconductors)

Analytical Model for CW-Laser Cleaving of Semiconductors
Authors:
Viktor Schütz, Laser Zentrum Hannover e.V.; Hannover Germany
Oliver Haupt, Laser Zentrum Hannover e.V.; Hannover Germany
Rainer Kling, Laser Zentrum Hannover e.V.; Hannover Germany
Presented at ICALEO 2009

The cw-laser cleaving process strongly depends on the temperature rise in the semiconductor and therefore from the active and passive process parameters. In the past, various methods have been developed to evaluate the process parameters in cw-laser processing of materials. The finite element method is a powerful tool for simulating heat conduction for all kinds of geometries, however, it turns out to...

ICALEO 2009 Paper #M307 (Rapid Prototyping of Microchannels into Silicon with a Femtosecond Fiber Laser)

Rapid Prototyping of Microchannels into Silicon with a Femtosecond Fiber Laser
Authors:
Dong Hyuck Kam, CLAIM, The University of Michigan; Ann Arbor MI USA
Jyoti Mazumder, Clpam, the University of Michigan; Ann Arbor MI USA
Presented at ICALEO 2009

We report on rapid prototyping of microchannels into silicon wafer with a femtosecond pulsed laser. The microchannel is a basic component composing microfludic structures for biomedical applications. In development of such micro-fluidic structures, the mask-less laser direct writing will reduce time and cost as a tool for rapid prototyping compared with the conventional photolithography based technique. While fs ablation ends to be more ...

ICALEO 2009 Paper #M308 (Laser Micro Processing of Metal and Silicon Using 100Khz and 2Mhz Ultrafast Lasers)

Laser Micro Processing of Metal and Silicon Using 100Khz and 2Mhz Ultrafast Lasers
Authors:
John Lopez, Alphanov; Talence France
Charly Loumena, Alphanov; Talence France
Victor Archambault, Alphanov; Talence France
Yoann Zaouter, Amplitude Systemes; Pessac France
Alexandre Trisorio, Amplitude Systemes; Pessac France
Marc Faucon, Alphanov; Talence France
Eric Mottay, Amplitude Systemes; Pessac France
Presented at ICALEO 2009

Ultrafast laser micromachining has been widely proven to be a high quality, high flexibility process, with numerous potential, industrial applications. Indeed, femtosecond laser is a key technology...

ICALEO 2009 Paper #M402 (Advances in Laser Based Joining Processes of Micro-Devices using Localised Heating)

Advances in Laser Based Joining Processes of Micro-Devices using Localised Heating
Authors:
Norbert Lorenz, Heriot-Watt University; Edinburgh Great Britain
Martin D. Smith, Heriot-Watt University; Edinburgh
Suzanne Millar, Heriot-Watt University; Edinburgh Great Britain
Marc Desmulliez, Heriot-Watt University; Edinburgh
Duncan P. Hand, Heriot-Watt University; Edinburgh Great Britain
Presented at ICALEO 2009

One of the remaining issues in the fabrication of micro-devices, including MEMS, is the packaging process. Standard techniques involve heating the whole device to high temperatures, preventing the use of temperature-sensitive materials wi...

ICALEO 2009 Paper #M403 (High-Efficiency and High Quality Welding of Aluminum Alloy by Hybrid System Combined Nd:YAG Laser and Diode Laser)

High-Efficiency and High Quality Welding of Aluminum Alloy by Hybrid System Combined Nd:YAG Laser and Diode Laser
Authors:
Tomokazu Sakagawa, Kataoka Corporation; Yokohama-City Kanagawa Japan
Shin-Ichi Nakashiba, Kataoka Corporation; Yokohama, Kanagawa Japan
Shin Haraguchi, Okayama University; Okayama Japan
Yasuhiro Okamoto, Okayama University; Okayama Japan
Yoshiyuki Uno, Okayama University; Okayama Japan
Presented at ICALEO 2009

Recently, the welding of aluminum alloy has been strongly required for lightening the electronic products, automobiles and so on. Then hybrid laser system was newly developed in order to perform the high efficiency ...

ICALEO 2009 Paper #M404 (Laser Welding of Aluminum and Copper for Battery Welding Applications using a 500W Single Mode Fiber Laser)

Laser Welding of Aluminum and Copper for Battery Welding Applications using a 500W Single Mode Fiber Laser
Authors:
Geoff Shannon, Miyachi Unitek Corporation; Monrovia CA USA
Hongqiang Chen, Miyachi Unitek Corporation; Monrovia CA USA
Presented at ICALEO 2009

The high brightness of single mode fiber lasers provides an excellent cutting source however in welding can be detrimental to weld quality, especially for ferrous materials. For conductive materials such as aluminum and copper the use of a single mode fiber presents some clear advantages of welding speed and cost effective welding solution. The ability to a focus to a sub 25 micron spot size enables the single mode fiber las...