ICALEO 2013 Paper #M805 (Robusteness of the Laser Melting Process)

Robusteness of the Laser Melting Process
Authors:
Heiko Bruening, Bias - Bremer Institut Fuer Angewandte Strahltechnik Gmbh; Bremen Germany
Presented at ICALEO 2013

The use of laser technologies in material processing is wide spread in various manufacturing chains such as welding, brazing and cutting. Compared to other heat sources, the laser beam enables the allocation of a certain amount of energy in a specific time on a very small spot. For this reason, the laser especially is a suitable tool for material processing in micro range. Due to the fact that processes in micro range are rather influenced by forces related to the surface of the work piece than by forces related to their volume, a p...

ICALEO 2013 Paper #M708 (Structural Changes in Single-Walled Carbon Nanotubes Induced by Pulsed Laser Irradiation)

Structural Changes in Single-Walled Carbon Nanotubes Induced by Pulsed Laser Irradiation
Authors:
Jeonghong Ha, POSTECH; POHANG South Korea
Dongsik Kim, POSTECH; Pohang South Korea
Presented at ICALEO 2013

Carbon nanotubes (CNTs) have great electrical, mechanical and thermal properties compared to conventional materials. However, the naturally-bundled structure, lattice imperfections and impurities seriously limit their engineering applications. There have been attempts to use laser beams to remove the imperfections and impurities but the interaction between high-power laser pulses and CNT structures is still vaguely understood. In this work, the structural changes in single-walled...

ICALEO 2013 Paper #M707 (High Precision 2.5D Laser Cutting of Thin Nitinol and Polyurethane for Medical Applications)

High Precision 2.5D Laser Cutting of Thin Nitinol and Polyurethane for Medical Applications
Authors:
Frank Zibner, Fraunhofer Institute for Laser Technology ; Aachen Germany
Joachim Ryll, Fraunhofer Institute for Laser Technology Ilt; Aachen Germany
Jens Holtkamp, Fraunhofer Institute for Laser Technology Ilt; Aachen Germany
Arnold Giller, Fraunhofer Institute for Laser Technology Ilt; Aachen Germany
Presented at ICALEO 2013

High precision laser cutting is extensively used in many medical applications. Materials like polyurethane and nitinol operate as catheters, heart valves, stents or systems combined of both materials. Industrial cutting machines that c...

ICALEO 2013 Paper #M706 (Investigation of the Cutting Performance of Laser Dressed Metal Bonded Diamond Blades)

Investigation of the Cutting Performance of Laser Dressed Metal Bonded Diamond Blades
Authors:
Philipp von Witzendorff, Laser Zentrum Hannover e.V.; Hannover Germany
Oliver Suttmann, Laser Zentrum Hannover E.V.; Hannover Germany
Ludger Overmeyer, Laser Zentrum Hannover E.V.; Hannover Germany
Manuel Stompe, Leibniz University Hanover; Garbsen Germany
Lutz Rissing, Leibniz University Hanover; Garbsen Germany
Presented at ICALEO 2013

Cutting of hard and brittle materials as Sintered Silicon Carbide (SSiC) is an obstacle for implementing SSIC into MEMS applications. Wear and accuracy loss of resin-bonded diamond blades are significant. In contrast...

ICALEO 2013 Paper #M704 (Trans-Wafer Processing of Semiconductors with Nanosecond Mid-Ir Laser Radiation)

Trans-Wafer Processing of Semiconductors with Nanosecond Mid-Ir Laser Radiation
Authors:
Ilya Mingareev, Townes Laser Institute, University of Central Florida; Orlando FL USA
Tobias Bonhoff, Townes Laser Institute, University of Central Florida; Orlando FL USA
Nils Gehlich, Townes Laser Institute, University of Central Florida; Orlando FL USA
Ashraf El-Sherif, Townes Laser Institute, University of Central Florida; Orlando FL USA
Christian Gaida, Townes Laser Institute, University of Central Florida; Orlando FL USA
Pankaj Kadwani, Townes Laser Institute, University of Central Florida; Orlando FL USA
Martin Gebhardt, Townes Laser Institu...

ICALEO 2013 Paper #M703 (Singulation of Semiconductor Package by Superposition of Pulsed Fiber Laser and Green Yag Laser)

Singulation of Semiconductor Package by Superposition of Pulsed Fiber Laser and Green Yag Laser
Authors:
Yasuhiro Okamoto, Okayama University; Okayama Japan
Kento Shirasaya, Okayama University; Okayama Japan
Ryoji Kitada, Okayama University; Okayama Japan
Akira Okada, Okayama University; Okayama Japan
Presented at ICALEO 2013

The application of laser beam processing has been expected in the field of semiconductor devices because of its flexible cutting line and narrow kerf width. However, the deterioration of cutting quality would occur in the case of themosensitive materials due to the thermal damage, since the laser beam processing is mainly thermal proc...

ICALEO 2013 Paper #M605 (Laser Joining of Charge-Collection Tapes Onto Cigs Photovoltaics Modules)

Laser Joining of Charge-Collection Tapes Onto Cigs Photovoltaics Modules
Authors:
Ralf Nett, Ruhr-Universitaet Bochum, Applied Laser Technolgy; Bochum Germany
Kerstin Kowalick, Ruhr-Universitaet Bochum, Applied Laser Technology; Bochum Germany
Manuel Joop, Ruhr-Universitaet Bochum, Applied Laser Technology; Bochum Germany
Benjamin Schoeps, Ruhr-Universitaet Bochum, Applied Laser Technology; Bochum Germany
Andreas Ostendorf, Ruhr-Universitaet Bochum, Applied Laser Technology; Bochum Germany
Christoph Ruettimann, Rofin-Lasag AG; Thun Switzerland
David Bremaud, FLISOM AG; Duebendorf Switzerland
Presented at ICALEO 2013

C...

ICALEO 2013 Paper #M604 (Extension of the Process Boundaries for the Soldering of Elongated Interconnectors with a Simultaneous Energy Deposition)

Extension of the Process Boundaries for the Soldering of Elongated Interconnectors with a Simultaneous Energy Deposition
Authors:
Simon W. Britten, Fraunhofer Institute for Laser Technology Ilt; Aachen Germany
Wolfgang Fiedler, Fraunhofer Institute for Laser Technology Ilt; Aachen Germany
Alexander Olowinsky, Fraunhofer Institute for Laser Technology Ilt; Aachen Germany
Arnold Gillner, Fraunhofer Institute for Laser Technology Ilt; Aachen Germany
Presented at ICALEO 2013

Soldering processes are used to bond elongated interconnectors to metallized silicon wafers e.g. solar cells. The minimal process time is expected to be limited due to the maximal therm...

ICALEO 2013 Paper #M603 (Remote Micro Welding with Multi-Mode and Single-Mode Fiber Lasers - a Comparison)

Remote Micro Welding with Multi-Mode and Single-Mode Fiber Lasers – a Comparison
Authors:
Andreas Patschger, Ernst-Abbe-Fachhochschule Jena; Jena Germany
Michael Guepner, Ernst-Abbe-Fachhochschule Jena; Jena Germany
Jens Bliedtner, Ernst-Abbe-Fachhochschule Jena; Jena Germany
Jean Pierre Bergmann, Technische Universitaet Ilmenau; Ilmenau Germany
Presented at ICALEO 2013

Both, multi-mode and single-mode lasers are well established in welding applications. In micro welding, single-mode lasers are often used while multi-mode lasers are more common regarding welding tasks in macro range. However, multi-mode lasers provide several advantages. Focal shifts du...

ICALEO 2013 Paper #M601 (Structuring and joining transparent materials with ultra short pulse lasers)

Structuring and joining transparent materials with ultra short pulse lasers
Authors:
Sinisa Vukelic, -; -
Panjawat Kongsuwan, -; -
Y. Lawrence Yao, -; -
Presented at ICALEO 2013

Nonlinear absorption of femtosecond-laser pulses enables the induction of structural changes in the interior of bulk transparent materials without affecting their surface. Features are generated by focusing the femtosecond laser pulses in the interior of a single glass piece to investigate change in morphology, mechanical properties, and ring structures of the modified region. Detailed characterization of the effect of laser irradiation is accomplished using differential interference con...