ICALEO 2007 Paper #M1304 (Laser Micromachining of Surface Pores on Ti for Biomedical Application)
Laser Micromachining of Surface Pores on Ti for Biomedical Application
Authors:
HC Man, Hong Kong Polytechnic University; Kowloon Hong Kong
Q Wang, The Hong Kong Polytechnic University; kowloon Hong Kong
X Guo, The Hong Kong Polytechnic University; Kowloon Hong Kong
Presented at ICALEO 2007
The surface condition of a dental implant affects the performance of tissue integration and its stability. In order to enhance these issues, laser texturing the surface of Titanium dental implants have been investigated by many researchers. Most of these studies involved texturing of dimples or drilling of surface blind pores at regular interval. This paper reports a new method to p...$28.00
ICALEO 2007 Paper #M1303 (Characteristics of High-Aspect Ratio Nanosecond Laser Ablation of Silicon at 355nm Wavelength)
Characteristics of High-Aspect Ratio Nanosecond Laser Ablation of Silicon at 355nm Wavelength
Authors:
Sedao, National Centre for Laser Applications, Nui; Galway Ireland
Alan Conneely, Ncla; Galway Ireland
Gerard O'Connor, NCLA; Galway Ireland
Thomas Glynn, Ncla; Galway Ireland
Presented at ICALEO 2007
We report on pulsed laser ablation for dicing/scribing monocrystalline silicon with a frequency tripped DPSS Q-switched nanosecond laser (355nm, AVIA, Coherent). Using a Galvanometer scanhead, a laser beam (repetition rate 30 kHz, 140µJ per pulse) was focused down to a 30µm diameter spot on silicon wafer and scanned in single-line mode. A series of slots...$28.00
ICALEO 2007 Paper #M1302 (A Selective Direct Patterning Process of Multilayer using Deep UV Laser)
A Selective Direct Patterning Process of Multilayer using Deep UV Laser
Authors:
D.Y. Kim, LG Electronics ; Kyungki-Do South Korea
JoongYong An, LG Electronics PERI; Pyeongtaek-si, Gyeonggi-do South Korea
Y.M. Jeong, LG Electronics ; Kyungki-Do South Korea
J.W. Kim, LG Electronics ; Kyungki-Do South Korea
K.Y. Baek, LG Electronics ; Kyungki-Do South Korea
H.S. Kang, LG Electronics ; Kyungki-Do South Korea
S.K. Hong, LG Electronics ; Kyungki-Do South Korea
Presented at ICALEO 2007
A traditional pattern making processes by exposure process require PR coating, exposure, develop, etching and PR strip. This causes high equ...$28.00
ICALEO 2007 Paper #M1301 (UV Laser Processes for FPCB Cutting)
UV Laser Processes for FPCB Cutting
Authors:
Dongsig Shin, KIMM (Korea Institute of Mechical and Materials); Daejeon South Korea
Jaehoon Lee, KIMM; Daejeon South Korea
Yongwoon Chung, KIMM; Daejeon South Korea
Hyonkee Sohn, KIMM; Daejeon South Korea
Presented at ICALEO 2007
The application of lasers in the area of microelectronics is growing and diversifying to innovative technologies to enable the increased sophistication of their products. Lasers are employed in manufacturing processes as varied as semiconductor lithography, wafer dicing, and micro-welding via drilling and FPCB cutting. In particular, the laser ablation process is required in sophisticat...$28.00
ICALEO 2007 Paper #M1207 (High Repetition Rate Ultrashort Pulse Picosecond Laser Amplifier)
High Repetition Rate Ultrashort Pulse Picosecond Laser Amplifier
Authors:
Clemens Hoenninger, Amplitude Systemes; Pessac France
Eric Mottay, Amplitude Systemes; Pessac France
Martin Delaigue, Amplitude Systemes; Pessac France
Presented at ICALEO 2007
Precision micro machining in an industrial environment demands stable and high performance short pulse laser systems. We demonstrate a laser system with >10 W average output power, pulse repetition rates between 50 and 100 kHz, and a pulse duration close to one picosecond. The compact laser system consists of a short pulse oscillator module and a regenerative amplifier module. The seed pulses of several tens of nanojoules ...$28.00
ICALEO 2007 Paper #M1206 (70-FS Pulses Produced by Parabolic Amplification in a Fiber Laser Amplifier)
70-FS Pulses Produced by Parabolic Amplification in a Fiber Laser Amplifier
Authors:
Yoann Zaouter, Amplitude Systemes; Pessac France
D. Papadopoulos, Institut d'Optique; Palaiseau France
Eric Cormier, Centre Lasers Intenses et Applications; Talence France
Marc Hanna, Institut d'Optique; Palaiseau France
Eric Mottay, Amplitude Systemes; Pessac France
Frederic Druon, Institut d'Optique; Palaiseau France
Patrick Georges, Institut d'Optique; Palaiseau France
Presented at ICALEO 2007
Femtosecond diode-pumped Yb-doped fiber lasers are very attractive systems for athermal, high speed micromachining. They can produce simulta...$28.00
ICALEO 2007 Paper #M1205 (High Energy, High Repetition Rate Ytterbium Doped Fiber Chirped Pulse Amplifier)
High Energy, High Repetition Rate Ytterbium Doped Fiber Chirped Pulse Amplifier
Authors:
Yoann Zaouter, Amplitude Systemes; Pessac France
Eric Mottay, Amplitude Systemes; Pessac France
Eric Cormier, Universite Bordeaux 1; Talence France
Presented at ICALEO 2007
There is an extremely rapidly growing interest in the development of efficient, compact, reliable high repetition rate ultrafast laser sources with high energy per pulse (in excess of a few µJ) with a very high average power (several tens of watts). We report on a laser source which generates sub-picosecond pulses at a 1MHz repetition rate. A high energy, low repetition rate bulk oscillator is seeded in an Ytte...$28.00
ICALEO 2007 Paper #M1204 (High Pulse Energy Excimer Lasers for Nanotechnology)
High Pulse Energy Excimer Lasers for Nanotechnology
Authors:
Ralph Delmdahl, Coherent GmbH; Goettingen Germany
Vadim Berger, Coherent GmbH; Gottingen Germany
Hans-Stephan Albrecht, Coherent GmbH; Gottingen Germany
Rainer Patzel, Coherent GmbH; Gottingen Germany
Presented at ICALEO 2007
Stable, high energy excimer lasers provide pulsed output energies ranging from 50 mJ up to 1000 mJ in the ultraviolet region with photon energies as high as 5 eV (248 nm), 6.3 eV (193 nm) or 7.9 eV (157 nm). Shortest ablation wavelengths strongly couple with every material, deliver highest lateral and depth resolution and significantly reduce the size of particulates in the ...$28.00
ICALEO 2007 Paper #M1203 (Development of a 53-W 343-nm UV Laser for Next Generation Material Processing)
Development of a 53-W 343-nm UV Laser for Next Generation Material Processing
Authors:
Santanu Basu, Sparkle Optics Corporation; Rolling Hills Estates CA USA
Presented at ICALEO 2007
Drilling of small diameter holes (< 0.2 mm) in thick (> 2 mm) industrial materials require high peak power lasers of single-mode beam quality and at a wavelength that is absorbed by the material. The number of holes drilled per second or the processing throughput increases linearly with the laser average power. In this paper, we will present the results of a rotary disk laser, which is a completely new type of pulsed solid state laser system that produces the ideal combination of high peak power, high average pow...$28.00
ICALEO 2007 Paper #M1202 (Generation of Intense Vacuum Ultraviolet Radiations for Advanced Materials Processing)
Generation of Intense Vacuum Ultraviolet Radiations for Advanced Materials Processing
Authors:
Atushi Yokotani, University of Miyazaki; Miyazaki Japan
Masahito Katto, University of Miyazaki; Miyazaki Japan
Shoichi Kubodera, University of Miyazaki; Miyazaki Japan
Masanori Kaku, University of Miyazaki; Miyazaki Japan
Akira Hosotani, University of Miyazaki; Miyazaki Japan
Noriaki Miyanaga, ILE, Osaka University; Suita Japan
Kunioki Mima, ILE, Osaka University; Suita Japan
Presented at ICALEO 2007
We have been developing high intense vacuum ultraviolet (VUV) radiations for the advanced applications such as micro and preci...$28.00
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