ICALEO 2013 Paper #M101 (Micro Scale Laser Based Additive Manufacturing for Metals)
Micro Scale Laser Based Additive Manufacturing for Metals
Authors:
Maximilian Schniednharm, Chair for Laser Technology LLT; Aachen
Matthias Belting, Fraunhofer Institute for Laser Technology Ilt; Aachen
Rui Joao, Fraunhofer Institute for Laser Technology Ilt; Aachen
Wilheim Meiners, Fraunhofer Institute for Laser Technology Ilt; Aachen
Andreas Weisheit, Fraunhofer Institute for Laser Technology Ilt; Aachen
Presented at ICALEO 2013
TBA$28.00
ICALEO 2013 Paper #M201 (Dicing of Thin Si Wafers with a Picosecond Laser Ablation Process)
Dicing of Thin Si Wafers with a Picosecond Laser Ablation Process
Authors:
Christian Fornaroli, Fraunhofer ILT; Aachen Germany
Jens Holtkamp, Fraunhofer Ilt; Aachen
Arnold Gillner, Fraunhofer Ilt; Aachen
Presented at ICALEO 2013
These days common way to produce electrical components like LEDs or computer chips is a batch process. Therefore a lot of identical components are processed parallel on one big wafer and
eventually each chip has to be singulated. Mechanical sawing with diamond blades have been used for a long time but as the wafer material is
getting thinner and the chip size smaller, this classical process is replaced by laser based dicing processes. Esp...$28.00
ICALEO 2013 Paper #M202 (Parallel Femtosecond Laser Processing using Intensity Modulated Diffraction Pattern Produced with Spatial Light Modulator)
Parallel Femtosecond Laser Processing using Intensity Modulated Diffraction Pattern Produced with Spatial Light Modulator
Authors:
Jarno Kaakkunen, VTT Technical Research Centre of Finland; Lappeenranta Finland
Martti Silvennoinen, University of Eastern Finland, Department of Physics and Mathematics; Joensuu Finland
Kimmo Paivasaari, University of Eastern Finland, Department of Physics and Mathematics; Joensuu Finland
Petri Laakso, VTT Technical Research Centre of Finland; Lappeenranta Finland
Pasi Vahimaa, University of Eastern Finland, Department of Physics and Mathematics; Joensuu Finland
Presented at ICALEO 2013
Due to technical developmen...$28.00
ICALEO 2013 Paper #M203 (High Throughput Surface Structuring with Ultrashort Pulses in Synchronized Mode with Fast Polygon Line Scanner)
High Throughput Surface Structuring with Ultrashort Pulses in Synchronized Mode with Fast Polygon Line Scanner
Authors:
Beat Neuenschwander, Bern University of Applied Sciences; Burgdorf Switzerland
Beat Jaeggi, Bern University of Applied Sciences Engineering and Information Technology; Burgdorf Switzerland
Markus Zimmermann, Bern University of Applied Sciences Engineering and Information Technology; Burgdorf Switzerland
Lars Penning, Next Scan Technology Bv; Bd Silvolde Netherlands
Ronny De Loor, Next Scan Technology Bv; Bd Silvolde Netherlands
Kurt Weingareten, Time Bandwidth Products Ag; Zuerich Switzerland
Andreas Oehler, Time Band...$28.00
ICALEO 2013 Paper #M303 (Parameters of Influence in Surface Ablation of Metals with using a High Power Tunable Ultrafast Laser)
Parameters of Influence in Surface Ablation of Metals with using a High Power Tunable Ultrafast Laser
Authors:
John Lopez, Univ Bordeaux; Talence Cedex France
Yoann Zaouter, Amplitude Systemes; Pessac France
Eric Mottay, Amplitude Systemes; Pessac France
Clemens Hoenninger, Amplitude Systemes; Pessac France
Marc Faucon, Alphanov; Talence France
Rainer Kling, Alphanov; Talence France
Remi Torres, Alphanov; Talence France
Patrick Georges, Institut Optique Graduate School; Orsay France
Marc Hanna, Institut Optique Graduate School; Orsay France
Presented at ICALEO 2013
High power ultrafast lasers...$28.00
ICALEO 2013 Paper #M304 (Structuring Features of Micro- and Nano-Ripples Induced by Oblique Incident Linear Polarized Femtosecond Laser Irradiating Metal Surface)
Structuring Features of Micro- and Nano-Ripples Induced by Oblique Incident Linear Polarized Femtosecond Laser Irradiating Metal Surface
Authors:
Xiang Ming Dong, Institute of Laser Engineering, Beijing University of Technology, China; Beijing Peoples Republic of China
Haiying Song, Institute of Laser Engineering, Beijing University of Technology, China; Beijing Peoples Republic of China
Song Liu, Institute of Laser Engineering .Beijing University of Technology; Beijing Peoples Republic of China
Shibing Liu, Institute of Laser Engineering, Beijing University of Technology, China; Beijing Peoples Republic of China
Presented at ICALEO 2013
The periodic ri...$28.00
ICALEO 2013 Paper #M305 (Sequential Colorization of Steel Surface by Ps Laser Texturing)
Sequential Colorization of Steel Surface by Ps Laser Texturing
Authors:
Peixun Fan, Tsinghua University; Beijing Peoples Republic of China
Minlin Zhong, Tsinghua University; Beijing Peoples Republic of China
Cheng Lin, Tsinghua University; Beijing Peoples Republic of China
JIangyou Long, Tsinghua University; Beijing Peoples Republic of China
Hongjun Zhang, Tsinghua University; Beijing Peoples Republic of China
Presented at ICALEO 2013
Intrinsically, most metals are gray or silvery white in appearance. However, to render metal surfaces to various desirable colors without changing their chemical composition is necessary and important in many app...$28.00
ICALEO 2013 Paper #M401 (High Density Through Glass Vias for Advanced Chip Packaging)
High Density Through Glass Vias for Advanced Chip Packaging
Authors:
Rainer Paetzel, Coherent Lasersystems Gmbh & Co. Kg; Goettingen Germany
Ralph Delmdahl, Coherent Lasersystems Gmbh & Co. Kg; Goettingen Germany
Rolf Senczuk, Coherent Lasersystems Gmbh & Co. Kg; Goettingen Germany
Jan Brune, Coherent Lasersystems Gmbh & Co. Kg; Goettingen Germany
Presented at ICALEO 2013
Glass is a promising material from which advanced interposers for high density electrical interconnects for 2.5D chip packaging can be produced. The supply of ultra-thin glass wafers with thicknesses of 100 µm and below is cost-comparable relative to polished thin wafers made of sili...$28.00
ICALEO 2013 Paper #M402 (Industrial Femtosecond Laser Systems and Applications in Precision Machining of Glass and Metal)
Industrial Femtosecond Laser Systems and Applications in Precision Machining of Glass and Metal
Authors:
Michael Mielke, Raydiance, Inc.; Petaluma CA USA
X Peng, Raydiance, Inc.; Petaluma CA USA
K Kim, Raydiance, Inc.; Petaluma CA USA
D Gaudiosi, Raydiance, Inc.; Petaluma CA USA
M Greenberg, Raydiance, Inc.; Petaluma CA USA
M Shirk, Raydiance, Inc.; Petaluma CA USA
E Juban, Raydiance, Inc.; Petaluma CA USA
W Lee, Raydiance, Inc.; Petaluma CA USA
G Masor, Raydiance, Inc.; Petaluma CA USA
X Gu, Raydiance, Inc.; Petaluma CA USA
R Lu, Raydiance, Inc.; Petaluma CA USA
M Hamamo...$28.00
ICALEO 2013 Paper #M403 (Sapphire Cutting with Pulsed Fiber Lasers)
Sapphire Cutting with Pulsed Fiber Lasers
Authors:
Christoph Ruettimann, LASAG AG; Thun Switzerland
Noemie Dury, Rofin-Lasag Ag; Thun Switzerland
Colin Woratz, Rofin-Lasag Ag; Thun Switzerland
Stefan Woessner, Manz Ag; Reutlingen Germany
Presented at ICALEO 2013
Sapphire cutting is currently one of the largest emerging markets in laser materials processing. Sapphire is one of the hardest existing transparent materials. Its mechanical and optical properties made it the ideal and precious choice for various components like cover glasses of watches, displays of mobile devices, protection windows for cameras, or LED carriers. Sapphire cutting with solid state ...$28.00