Exciting News—A New LIA Website Launches Soon!

We’re thrilled to announce our new website will go live on Sunday, November 24, 2024! Experience a fresh design, enhanced usability, and improved accessibility.

Planned Outage: To ensure a smooth launch, our website will be offline from 8 PM (EST) on Saturday, November 23, 2024, until 12 PM (EST) on Sunday, November 24, 2024. Click here for a sneak peek of what’s coming!

  • PICALO 2008 Paper #1001 (Comparative Study of Techniques for Wear Minimisation of Engine Parts)

    Comparative Study of Techniques for Wear Minimisation of Engine Parts
    Authors:
    Aiping Wu, Beijing Insitute of Opto-Electronic Technology; Beijing Peoples Republic of China
    Martin Dahmen, Fraunhofer-Institut Lasertechnik; 52074 Aachen Germany
    Stefan Kaierle, Fraunhofer-Institut Lasertechnik; 52074 Aachen Germany
    Wenjin Liu, Department of Mechanical Engineering, Qinghua University; Beijing Peoples Republic of China
    Yi Shen, February 7Th Railway Transportation Equipment; Beijing Peoples Republic of China
    Presented at PICALO 2008

    In order to increase wear resistance investigations of locomotive engine parts on the comparison of different technique...

    $28.00

  • PICALO 2008 Paper #1004 (Integrated Heat Treatment - Comparison of Different Machine Concepts)

    Integrated Heat Treatment – Comparison of Different Machine Concepts
    Authors:
    Jan Hannweber, Fraunhofer Iws; Dresden Germany
    Marko Seifert, Fraunhofer I W S; Dresden Germany
    Steffen Bonss, Fraunhofer IWS; Dresden Germany
    Udo Karsunke, Fraunhofer Iws; Dresden Germany
    Berndt Brenner, Fraunhofer I W S; Dresden Germany
    Eckhard Beyer, Fraunhofer I W S; Dresden Germany
    Presented at PICALO 2008

    Heat treatment of machine components or automotive parts traditionally is done at separate facilities or companies. Very effective manufacturing becomes possible if heat treatment processes can be integrated in line to avoid logistics and to sav...

    $28.00

  • PICALO 2008 Paper #1005 (Laser Material Processing in the Aero Engine Industry. Established, Cutting-Edge and Emerging Applications.)

    Laser Material Processing in the Aero Engine Industry. Established, Cutting-Edge and Emerging Applications.
    Authors:
    Karl-Hermann Richter, MTU Aero Engines; Munich Germany
    Presented at PICALO 2008

    Laser machining processes are widely used in the manufacture and repair of aero engine components. This presentation provides examples of well-established, cut-ting-edge and emerging laser machining processes. A well-established process is laser drilling which has been in use for more than 25 years to produce cooling holes in combustors and particularly in high-pressure turbine (HPT) blades and vanes. To enhance the cooling efficiency a novel laser machining technique has been devel-oped to produce sh...

    $28.00

  • PICALO 2008 Paper #1009 (Nopaltzin Li: The New Laser Machine for Cactus Cleaning with Optical Detection of Spines)

    Nopaltzin Li: The New Laser Machine for Cactus Cleaning with Optical Detection of Spines
    Authors:
    Luis Ponce, CICATA-IPN; altamira, tamps Mexico
    M. Arronte, Cicta-Ipn; Altamira Mexico
    B. Lambert, Cicta-Ipn; Altamira Mexico
    J. Cabrera, Cicta-Ipn; Altamira Mexico
    O. Cruzata, Cicta-Ipn; Altamira Mexico
    T. Flores, Cicta-Ipn; Altamira Mexico
    E. De Posada, Cicta-Ipn; Altamira Mexico
    Presented at PICALO 2008

    A new laser machine technology for selective cactus spines elimination was created. The machine automatically finds the spines by using optical detection and eliminates them without damage to the substrate. Each c...

    $28.00

  • PICALO 2008 Paper #101 (Current Challenges to Laser Cutting Application (Invited Paper))

    Current Challenges to Laser Cutting Application (Invited Paper)
    Authors:
    Takeji Arai, Chuo University ; Tokyo Japan
    Presented at PICALO 2008

    The laser cutting application is used widely in the world industrial field. Especially in Japan, the ratios that the application of the laser cutting occupies exceed 90% in the whole. Currently, the laser cutting technology for sheet metal cutting was developed instead of punching. Although it becomes the main technology, this technology is still in a stage of the middle of development and the technology is still improved rapidly.
    For the new challenges are always necessary for mature technology. In industry, nowadays, more high-speed cutting and accurat...

    $28.00

  • PICALO 2008 Paper #102 (Applications of a Novel Supersonic Laser Cutting Head (Invited Paper))

    Applications of a Novel Supersonic Laser Cutting Head (Invited Paper)
    Authors:
    Antonio Riveiro, Universidade De Vigo; Vigo Spain
    Juan Pou, Universidade de Vigo; Vigo Spain
    Felix Quintero, Universidade De Vigo; Vigo Spain
    Fernando Lusquinos, Universidade De Vigo; Vigo Spain
    Rafael Comesana, Universidade De Vigo; Vigo Spain
    Presented at PICALO 2008

    The use of lasers as cutting tools is well established in industry for processing of steels thanks to their great general advantages compared to traditional methods. However, there are materials difficult to be cut by standard laser cutting heads such as some aluminum alloys and ceramics. In this work...

    $28.00

  • PICALO 2008 Paper #103 (The Studies of Laser Oxygen Thick Section Cutting using Disk Laser)

    The Studies of Laser Oxygen Thick Section Cutting using Disk Laser
    Authors:
    Tao Zhang, Centre for Industrial Photonics; Cambridge Great Britain
    Martin Sparkes, Centre for Industrial Photonics; Cambridge Great Britain
    Markus Gross, Centre for Industrial Photonics; Cambridge Great Britain
    William O\'Neill, Centre for Industrial Photonics; Cambridge Great Britain
    Presented at PICALO 2008

    Laser Oxygen Thick Section Cutting (LOTSC), a cutting process which utilises the full performance of a supersonic oxygen gas jet for cutting (typically) 30-60 mm mild steel plate, has previously been examined primarily using the CO2 laser. This paper looks at some of the con...

    $28.00

  • PICALO 2008 Paper #104 (Study on the Machining Process of a New Laser Crack-Free Cutting Technique for Ceramics)

    Study on the Machining Process of a New Laser Crack-Free Cutting Technique for Ceramics
    Authors:
    Lingfei Ji, Institute of Laser Engineering, Beijing University of Technology; Beijing Peoples Republic of China
    Yinzhou Yan, Institute of Laser Engineering, Beijing University of Technology; Beijing Peoples Republic of China
    Yong Bao, Institute of Laser Engineering, Beijing University of Technology; Beijing Peoples Republic of China
    Yijian Jiang, Institute of Laser Engineering, Beijing University of Technology; Beijing Peoples Republic of China
    Presented at PICALO 2008

    Research on laser crack-free cutting of ceramics, especially for the thicker workpieces, has ...

    $28.00

  • PICALO 2008 Paper #105 (Laser Machining in Ceramics Manufacture (Invited Paper))

    Laser Machining in Ceramics Manufacture (Invited Paper)
    Authors:
    Duncan Hand, Heriot-Watt University; Edinburgh Great Britain
    Fraser Dear, Heriot-Watt University; Edinburgh Great Britain
    Jonathan Parry, Heriot-Watt University; Edinburgh Great Britain
    Jonathan Shephard, Heriot-Watt University; Edinburgh Great Britain
    Krzysztof Nowak, Heriot-Watt University; Edinburgh Great Britain
    Denis Hall, Heriot-Watt University; Edinburgh Great Britain
    Howard Baker, Heriot-Watt University; Edinburgh Great Britain
    Presented at PICALO 2008

    Ceramic materials are increasingly used across a range of industrial and medical applications, ...

    $28.00

  • PICALO 2008 Paper #106 (High Precision Machining and Cutting of Si using a Single Mode (Invited Paper))

    High Precision Machining and Cutting of Si using a Single Mode (Invited Paper)
    Authors:
    William O'Neill, University of Cambridge; Cambridge Great Britain
    K. Li, University of Cambridge; Cambridge Great Britain
    Tony Hoult, Spi Lasers Inc; Santa Clara CA USA
    Presented at PICALO 2008

    The application of lasers in the microelectronics sector has grown steadily over the past 10 years as DPSS lasers have increased power output and high levels of reliability. The readiness of such systems to operate at various output wavelengths such as 355nm has further enabled a greater range of processing operations for Si based microsystems. Recent advances in Yb doped fiber lasers with ...

    $28.00

Pages

Pages