ICALEO 2005 Paper #M807 (Laser Exposure System for Flat Panel Display Industry)
Laser Exposure System for Flat Panel Display Industry
Authors:
Kim Kwang-Ryul, LG Electronics Inc.; Pyungtaek, Kyunggido Korea
Yong-Woo Lee, LG Electronics Inc.; Pyungtaek, Kyunggido Korea
Hye-Won Kim, LG Electronics Inc.; Pyungtaek, Kyunggido Korea
In-Tae Park, LG Electronics Inc.; Pyungtaek, Kyunggido Korea
Hyoung-Shik Kang, LG Electronics Inc.; Pyungtaek, Kyunggido Korea
Sang-Bong Lee, LG Electronics Inc.
LG Electronics Inc.; Pyungtaek, Kyunggido Korea
Soon-Kook Hong, LG Electronics Inc.; Pyungtaek, Kyunggido Korea
Presented at ICALEO 2005
When screen size of the Flat Panel Display (FPD) becomes larger, the tradit...$28.00
ICALEO 2005 Paper #M804 (Cutting Flexible Printed Circuit Board with a 532nm Q-Switched Diode Pumped Solid State Laser)
Cutting Flexible Printed Circuit Board with a 532nm Q-Switched Diode Pumped Solid State Laser
Authors:
Matt Henry, Powerlase Ltd; Crawley Great Britain
Jozef Wendland, Powerlase Ltd; Crawley West Sussex UK
Paul Harrison, Powerlase Ltd; Crawley West Sussex UK
Duncan Parsons-Karavassilis, Powerlase Ltd; Crawley West Sussex UK
Presented at ICALEO 2005
The authors investigate the high speed laser cutting of flexible printed circuit boards (PCBs) using a low M2 532nm to create features >40 microns in size.
The use of flexible PCBs in portable electronics devices such as laptops, PDAs and mobile phones is increasing as such material offers advantages in terms o...$28.00
ICALEO 2005 Paper #M803 (Two-Dimensional Transient Modeling of CO2 Laser Drilling of Microvias in High Density Flip Chip Substrates)
Two-Dimensional Transient Modeling of CO2 Laser Drilling of Microvias in High Density Flip Chip Substrates
Authors:
Chong Zhang, Univ. of Central Florida, CREOL; Orlando Florida USA
Islam Salama, Intel-Assembly and Technology Development; Chandler AZ USA
Nathaniel Quick, AppliCote Associates LLC; Orlando FL USA
Aravinda Kar, Univ. of Central Florida, CREOL; Orlando Florida USA
Presented at ICALEO 2005
Thermal modeling is essential to understand the laser-materials interactions and to control CO2 laser drilling of blind microvias (< 50 um) through polymeric dielectric in multilayer electronic substrates. In order to understand the profile of the drilling fr...$28.00
ICALEO 2005 Paper #M802 (Laser Microtechnologies for Passive Elements of Electronic Circuits)
Laser Microtechnologies for Passive Elements of Electronic Circuits
Authors:
Ryszard Pawlak, Technical University of Lodz, Division of Materials Science & Electrotechnology; Lodz Poland
Franciszek Kostrubiec, Technical University of Lodz, Division of Materials Science & Electrotechnology; Lodz Poland
Maria Walczak, Technical University of Lodz, Division of Materials Science & Electrotechnology; Lodz Poland
Mariusz Tomczyk, Technical University of Lodz, Division of Materials Science & Electrotechnology; Lodz Poland
Presented at ICALEO 2005
Varied innovative laser-technologies introduced to manufacturing process of electronic circuits and devices were applie...$28.00
ICALEO 2005 Paper #M801 (Direct Fabrication of Conductive Lines and Resistors on Insulator Boards by Laser Micro-Cladding Electronic Pastes (Invited Paper))
Direct Fabrication of Conductive Lines and Resistors on Insulator Boards by Laser Micro-Cladding Electronic Pastes (Invited Paper)
Authors:
Xiaoyan Zeng, National Engineering Research Center for Laser Processing; Wuhan Peoples Republic of China
Xiangyou Li, National Engineering Research Center for Laser Processing, Huazhong University; Wuhan China
Presented at ICALEO 2005
The technique of laser direct writing has attracted a wide interest in the past ten years because it is a rapid and direct fabrication technique to manufacture the component prototype with small and even micro sizes and without needing masks. Different direct writing methods, such as laser induced chemical vapor d...$28.00
ICALEO 2005 Paper #M708 (Nanometer Ablation and Precision Processing Control Using NSOM-Delivered Femtosecond Laser Pulses)
Nanometer Ablation and Precision Processing Control Using NSOM-Delivered Femtosecond Laser Pulses
Authors:
Chen-Hsiung Cheng, Panasonic Boston Laboratory; Cambridge MA USA
Ming Li, Panasonic Boston Laboratory; Cambridge MA USA
Presented at ICALEO 2005
We have been developing a combined technique of using ultra-fast laser in conjunction with fiber-probe delivery to ablate substrate surface in near-field region. Often it is found too difficult to do an in-situ nanometer machining on a pre-formed nanometer structure using traditional optical microscope due to resolution limited by fundamental diffraction limit. Therefore a processing method with nanometer metrology that can be applied...$28.00
ICALEO 2005 Paper #M707 (Continuous Production and Online-Characterization of Nanoparticles from Ultrafast Laser Ablation and Laser Cracking)
Continuous Production and Online-Characterization of Nanoparticles from Ultrafast Laser Ablation and Laser Cracking
Authors:
Stephan Barcikowski, Laser Zentrum Hannover e.V.; Hannover Germany
Niko Baersch, Laser Zentrum Hannover e.V.; Hannover Germany
Michael Hustedt, Laser Zentrum Hannover e.V.; Hannover Germany
Ramin Sattari, Laser Zentrum Hannover e.V.; Hannover Germany
Andreas Ostendorf, Laser Zentrum Hannover e.V.; Hannover Germany
Presented at ICALEO 2005
Nano-particulate materials and composites show a remarkable nanoproduct market share of 23% with a volume of 17 billion USD in 2002. Compared to conventional nanoparticle production tec...$28.00
ICALEO 2005 Paper #M706 (Laser Sintering of Silver Nano-Particle Inks Deposited by Direct Write Technology)
Laser Sintering of Silver Nano-Particle Inks Deposited by Direct Write Technology
Authors:
Jacob Colvin, South Dakota School of Mines & Technology; Rapid City South Dakota USA
Oleg Starovoytov, South Dakota School of Mines & Technology; Rapid City South Dakota USA
James Sears, South Dakota School of Mines & Technology; Rapid City SD USA
Jan Puszynski, South Dakota School of Mines & Technology; Rapid City South Dakota USA
Michael Carter, South Dakota School of Mines & Technology; Rapid City South Dakota USA
Presented at ICALEO 2005
Direct Write Technologies are being used in antennas, engineered structures, sensors, and tissue engineering. Man...$28.00
ICALEO 2005 Paper #M705 (Laser Thin Film Deposition on Plastic Substrates using Silicon Nanoparticles for Flexible Electronics)
Laser Thin Film Deposition on Plastic Substrates using Silicon Nanoparticles for Flexible Electronics
Authors:
Sachin Bet, University of Central Florida/ School of Optics and Photonics CREOL; Orlando Florida USA
Aravinda Kar, University of Central Florida/ CREOL; Orlando Florida USA
Nathaniel Quick, AppliCote Associates, LLC.; Orlando Florida USA
Presented at ICALEO 2005
The melting temperature of silicon nanoparticles decreases significantly compared to the melting temperature of bulk silicon when the particle size is less than 5 nm. This concept is utilized for reducing the processing temperatures to deposit thin polycrystalline silicon (c-Si) films on plastic substr...$28.00
ICALEO 2005 Paper #M704 (Catalyst Deposition and Carbon Nanotubes Growth by Laser-Assisted Chemical)
Catalyst Deposition and Carbon Nanotubes Growth by Laser-Assisted Chemical
Authors:
J. Shi, University of Nebraska-Lincoln; Lincoln NE USA
K. Tan, University of Nebraska-Lincoln; Lincoln NE USA
X.W. Wang, University of Nebraska-Lincoln; Lincoln NE USA
Yongfeng Lu, University of Nebraska-Lincoln; Lincoln NE USA
Presented at ICALEO 2005
With the recent advances of the aligned growth of carbon nanotubes (CNTs), there are great interests in CNT based field-emission and MOS transistor applications. However, techniques of deposition of catalysts and growth of carbon nanotubes at desired position are still not fully developed. In this study, we will report a meth...$28.00
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