ICALEO 2012 Paper #M603 (Evaluation of Damaged Region at the Groove Edge of TCO Film in Pulsed Fiber Laser Processing)

Evaluation of Damaged Region at the Groove Edge of TCO Film in Pulsed Fiber Laser Processing
Authors:
Yasuhiro Okamoto, Okayama Univ.; Okayama Japan
Naoya Takahashi, Okayama Univ.; Okayama Japan
Shin-ichi Nakashiba, Kataoka Corporation; Yokohama Japan
Tomokazu Sakagawa, Kataoka Corporation; Yokohama Japan
Akira Okada, Okayama Univ.; Okayama Japan
Presented at ICALEO 2012

A pulsed fiber laser has been widely used for the removal of TCO film, since it is the compact oscillator with the flexible processing head. However, the wide range of emission wavelength from the fiber laser would deteriorate the edge quality of groove such as cracks and burr...

ICALEO 2012 Paper #M602 (Line Beam Laser Lift-Off Approach for Sapphire Removal)

Line Beam Laser Lift-Off Approach for Sapphire Removal
Authors:
Ralph Delmdahl, Coherent GmbH; Goettingen Germany
Rainer Paetzel, Coherent GmbH; Goettingen Germany
Jan Brune, Coherent GmbH; Goettingen Germany
Rolf Senczuk, Coherent GmbH; Goettingen Germany
Christian Gossler, Fraunhofer Institute for Applied Solid State Physics IAF; Freiburg Germany
Ruediger Moser, Fraunhofer Institute for Applied Solid State Physics IAF; Freiburg Germany
Michael Kunzer, Fraunhofer Institute for Applied Solid State Physics IAF; Freiburg Germany
Ulrich Schwarz, Fraunhofer Institute for Applied Solid State Physics IAF; Freiburg Germany

ICALEO 2012 Paper #M601 (Selective Femtosecond Laser Structuring of a Platinum/Tantalum Pentoxide Thin Film Layer System by Induced Laser Ablation Investigated with Pump-Probe Microscopy)

Selective Femtosecond Laser Structuring of a Platinum/Tantalum Pentoxide Thin Film Layer System by Induced Laser Ablation Investigated with Pump-Probe Microscopy
Authors:
Janosch Rosenberger, Munich Univ. of Applied Sciences; Munich Germany
Stephan Rapp, Munich Univ. of Applied Sciences; -
Matthias Domke, Munich Univ. of Applied Sciences; Munich Germany
Gerhard Heise, Munich Univ. of Applied Sciences; Munich Germany
Heinz P. Huber, Munich Univ. of Applied Sciences; Munich Germany
Presented at ICALEO 2012

A biocompatible sensor chip consists of a 200 nm conducting platinum layer between a glass substrate and a 200 nm tantalum pentoxide layer ...

ICALEO 2012 Paper #M508 (Influence of Surrounding Gas Type and Pressure Condition on Micro-Drilling of Silicon Carbide by Harmonics of Nd:YAG Laser)

Influence of Surrounding Gas Type and Pressure Condition on Micro-Drilling of Silicon Carbide by Harmonics of Nd:YAG Laser
Authors:
Yasuhiro Okamoto, Okayama Univ.; Okayama Japan
Shin Urushibata, Okayama Univ.; Okayama Japan
Akira Okada, Okayama Univ.; Okayama Japan
Tomokazu Sakagawa, Kataoka Corporation; Yokohama Japan
Shin-ichi Nakashiba, Kataoka Corporation; Yokohama Japan
Presented at ICALEO 2012

In this study, micro-machining characteristics of silicon carbide by the fundamental and the three kinds of harmonic of Nd:YAG laser were experimentally investigated in the viewpoints of wavelength and the surrounding condition. Moreover, micro-ma...

ICALEO 2012 Paper #M507 (Laser Transmission Welding with Part Adapted Temperature Fields)

Laser Transmission Welding with Part Adapted Temperature Fields
Authors:
Martin Devrient, blz Bayerisches Laserzentrum GmbH; Erlangen USA
Verena Wippo, LZH Laserzentrum Hannover e.V.; Hannover Germany
Peter Jaeschke, LZH Laserzentrum Hannover e.V.; Hannover Germany
Uwe Stute, LZH Laserzentrum Hannover e.V.; -
Thomas Frick, blz Bayerisches Laserzentrum GmbH; Erlangen Germany
Heinz Haferkamp, LZH Laserzentrum Hannover e.V.; Hannover Germany
Michael Schmidt, blz Bayerisches Lasersentrum GmbH, LPT Lehrstuhl Fuer Photonische Technologien der Friedrich-Alexander Univ. Erlangen-Nuernberg; Erlangen Germany
Presented at ICALEO 2012

ICALEO 2012 Paper #M506 (The Impact of Thermal Strain Rate on Laser Bonding of Polymer Films)

The Impact of Thermal Strain Rate on Laser Bonding of Polymer Films
Authors:
Colin Dowding, Lincoln School of Engineering, Univ. of Lincoln; Leicestershire Great Britain
Presented at ICALEO 2012

Laser bonding has great potential in numerous industries where process flexibility is required in combination with bond durability, consistency and repeatability. Previously, it has been shown that lasers are ideal for activating the bonding adhesive which then offers a bond force that is independent of laser power. This new work extends our understanding by characterising the bond strength response of the adhesive with respect to laser scan speed. This work confirms that the adhesive requires a thresh...

ICALEO 2012 Paper #M505 (CO2 Laser Free-Shape Cutting of Flexible Glass Substrates)

CO2 Laser Free-Shape Cutting of Flexible Glass Substrates
Authors:
Xinghua Li, Science and Technology, Corning Incorporated; Corning NY USA
Sean M. Garner, Science and Technology, Corning Incorporated; Corning NY USA
Presented at ICALEO 2012

We investigated CO2 laser free-shape cutting of flexible glass substrates. The technique uses tensile stress to propagate a full-body crack along the perimeter of the device to be cut. The tensile stress was generated by the CO2 laser heating and subsequent ambient air cooling process. A round laser beam was rapidly (>10 m/s) scanned along the perimeter of the device using an optical scanner. The rapidly moving laser beam generates a fast movin...

ICALEO 2012 Paper #M504 (Diagnostic and Simulation of ps-Laser Glass Cutting - Invited Presentation - 40 Minutes)

Diagnostic and Simulation of ps-Laser Glass Cutting - Invited Presentation - 40 Minutes
Authors:
Urs Eppelt, Fraunhofer Institute for Laser Technology, Nonlinear Dynamics of Laser Processing, RWTH Aachen Univ.; Aachen Germany
Simone Russ, TRUMPF Laser GmbH + Co. KG; Schramberg Germany
Claudia Hartmann, Fraunhofer Institute for Laser Technology; Aachen Germany
Mingying Sun, Fraunhofer Institute for Laser Technology; -
Christof Siebert, TRUMPF Laser- und Systemtechnik GmbH; Ditzingen Germany
Wolfgang Schulz, Fraunhofer Institute for Laser Technology, Nonlinear Dynamics of Laser Processing, RWTH Aachen Univ.; Aachen Germany
Presented at ICA...

ICALEO 2012 Paper #M502 (Singulation of Sapphire Substrate with High Aspect Ratio Internal Modification by Sub-Nanosecond Pulsed Fiber Laser)

Singulation of Sapphire Substrate with High Aspect Ratio Internal Modification by Sub-Nanosecond Pulsed Fiber Laser
Authors:
Yasuhiro Okamoto, Graduated School of Natural Science and Technology, Okayama Univ.; Okayama Japan
Kenta Takahashi, Graduated School of Natural Science and Technology, Okayama Univ.; Okayama Japan
Akira Okada, Graduated School of Natural Science and Technology, Okayama Univ.; Okayama Japan
Presented at ICALEO 2012

Sapphire is widely used for the substrate of high brightness LED, and it is important to reduce the edge damage in the singulation process of sapphire substrate for the high quality product and the cost reduction. In this study, the int...

ICALEO 2012 Paper #M406 (Micro-Laser-GMA Hybrid Welding - The Advancement from Macro to Micro Range)

Micro-Laser-GMA Hybrid Welding – The Advancement from Macro to Micro Range
Authors:
Uwe Reisgen, RWTH Aachen Univ., ISF Welding and Joining Institute; -
Simon Olschok, RWTH Aachen Univ., ISF Welding and Joining Institute; -
Stefan Jakobs, RWTH Aachen Univ., ISF Welding and Joining Institute; -
Michael Mavany, RWTH Aachen Univ., ISF Welding and Joining Institute; -
Presented at ICALEO 2012

Laser beam welding is characterized by high process speed and low energy input. A shorter processing time and also less distortion are the results. Expensive clamping and subassembly techniques are, however, setting limits to the application scope of laser...